tag: STMicroelectronics

Revving Up SiC And GaN
By Ann Mutschler - 13 Dec, 2021 - Comments: 0

Silicon carbide (SiC) and gallium nitride (GaN) are becoming more popular for power electronics, particularly in automotive applications, driving down costs as volumes scale up and increasing the demand for better tools to design, verify, and test these wide-bandgap devices. Both SiC and GaN are proving essential in areas such as battery management in electric vehicles. They can handle much ... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 10 Dec, 2021 - Comments: 0

Semicon West news The Semicon West trade show opened this week with a hybrid in-person and virtual event. Several companies introduced new products or made announcements at Semicon. Some announcements coincided with the show. At Semicon, Lam Research introduced the Syndion GP, a new product that provides deep silicon etch capabilities to chipmakers developing next-generation power devices a... » read more

Week In Review: Auto, Security, Pervasive Computing
By Susan Rambo - 10 Dec, 2021 - Comments: 0

Pervasive computing An outage in network equipment at the US-EAST-1 Region of Amazon Web Services this week reminded customers of the downside to having every appliance run via a data center. Users accessing apps tied to AWS on the East coast found services did not work, including Alexa, Ring, smart appliances, some Amazon warehouses and packaging delivery, web APIs such as Slack, and some str... » read more

China Accelerates Foundry, Power Semi Efforts
By Mark LaPedus - 22 Nov, 2021 - Comments: 4

China has unveiled several initiatives to advance its domestic semiconductor industry, including a new and massive fab expansion campaign in the foundry, gallium-nitride (GaN), and silicon carbide (SiC) markets. The nation is making a big push into what it calls “third-generation semiconductors,” which is a misnomer. The term actually refers to two existing and common power semiconductor... » read more

Chemistry Working For Lithography: The Marangoni-Effect-Based Single Layer For Enhanced Planarization
By Brewer Science - 17 Nov, 2021 - Comments: 0

In the field of semiconductor manufacturing, there is still a continuous search for techniques to improve the Critical Dimension Uniformity (CDU) across the wafer. CDU improvement and general defectiveness reduction increase the industrial yield and guarantee high reliability standards. In the KrF Dual-Damascene module integration, at a lithographic level, deep trench planarization is mandatory... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 05 Nov, 2021 - Comments: 0

Packaging Amkor plans to build a packaging plant in Bac Ninh, Vietnam. The first phase of the new factory will focus on providing system-in-package (SiP) assembly and test services for customers. The investment for the first phase of the facility is estimated to be between $200 million and $250 million. “This is a strategic, long-term investment in geographical diversification and factory... » read more

Optimizing System-Level Connectivity In Heterogenous Automotive Packages
By Keith Felton - 04 Nov, 2021 - Comments: 0

By Keith Felton and Cristina Somma With the massive growth of electronics in the automotive sector (such as autonomous driving, electric vehicles, and safety systems), the complexity, capabilities, and volume of semiconductors is rapidly increasing the demand for greater package connectivity density. This has led to high-end IC-package solutions, such as copper pillar bumping with very fi... » read more

Inspecting, Testing, And Measuring SiC
By Patrick Waurzyniak - 12 Oct, 2021 - Comments: 0

Achieving the auto industry's stringent zero defect goals is becoming a big challenge for makers of silicon carbide substrates, which are struggling to achieve sufficient yields and reliability as they migrate from 150mm to 200mm wafers and shift their focus away from pure silicon. SiC is a combination of silicon and harder carbide materials, and it has emerged as a key technology for batter... » read more

STMicroelectronics Methodology And Process For Heterogeneous Automotive Package Design
By Siemens EDA - 06 Oct, 2021 - Comments: 0

As a leading supplier of automotive semiconductors, STMicroelectronics must continue to move fast to develop and deliver leading-edge solutions. Employing package design as part of system innovation requires the STMicroelectronics Back-End Manufacturing Technology R&D organization to embrace the key driving forces of product development. In the automotive field, package designers need to... » read more

The Silicon Carbide Race Begins
By Patrick Waurzyniak - 20 Sep, 2021 - Comments: 0

The growing adoption of silicon carbide (SiC) for a variety of automotive chips has reached the tipping point where most chipmakers now consider it a relatively safe bet, setting off a scramble to stake a claim and push this wide-bandgap technology into the mainstream. SiC holds great promise for a number of automotive applications, particularly for battery electric vehicles. It can extend d... » read more

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