tag: Stony Brook University

Research Bits: Feb. 19
By Jesse Allen - 19 Feb, 2024 - Comments: 0

DNA assembly of 3D nanomaterials Scientists from Brookhaven National Laboratory, Columbia University, and Stony Brook University developed a method that uses DNA to instruct molecules to organize themselves into targeted 3D patterns and produce a wide variety of designed metallic and semiconductor 3D nanostructures. “We have been using DNA to program nanoscale materials for more than a de... » read more

Chip Industry Technical Paper Roundup: Feb. 6
By Liz Allan - 06 Feb, 2024 - Comments: 0

New technical papers added to Semiconductor Engineering’s library this week. [table id=187 /] More ReadingTechnical Paper Library home » read more

Hacking DNA To Make 3D Nanostructures
By Technical Paper Link - 02 Feb, 2024 - Comments: 0

A technical paper titled “Three-dimensional nanoscale metal, metal oxide, and semiconductor frameworks through DNA-programmable assembly and templating” was published by researchers at Brookhaven National Laboratory, Columbia University, and Stony Brook University. Abstract: "Controlling the three-dimensional (3D) nanoarchitecture of inorganic materials is imperative for enabling their no... » read more

Technical Paper Roundup: November 21
By Liz Allan - 21 Nov, 2023 - Comments: 0

New technical papers recently added to Semiconductor Engineering’s library: [table id=167 /] More Reading Technical Paper Library home » read more

Hybrid Photoresist Capable Of High-Resolution, Positive-Tone EUVL Patterning
By Technical Paper Link - 16 Nov, 2023 - Comments: 0

A technical paper titled “Vapor-Phase Infiltrated Organic–Inorganic Positive-Tone Hybrid Photoresist for Extreme UV Lithography” was published by researchers at Stony Brook University, Brookhaven National Laboratory, and University of Texas at Dallas. Abstract: "Continuing extreme downscaling of semiconductor devices, essential for high performance and energy efficiency of future microe... » read more

Week In Review: Design, Low Power
By Jesse Allen - 09 Dec, 2022 - Comments: 0

Tools, IP, design Codasip launched a new organization within the company to support the development and commercialization of technical innovations in key applications including security, functional safety, and AI/ML. "As semiconductor scaling is showing its limits, there is an obvious need for new ways of thinking. We will be working with universities, research institutes and strategic partner... » read more

Research Bits: Nov. 7
By Jesse Allen - 07 Nov, 2022 - Comments: 0

ADC side-channel attacks Researchers at MIT propose two ways to protect analog-to-digital converters (ADCs) from power and electromagnetic side-channel attacks. The researchers first investigated the side-channel attacks that could be used against ADCs. Power attacks usually involve an attacker soldering a resistor onto the device’s circuit board to measure its power usage. An electromagn... » read more

How To Test Autonomous Vehicles
By Kevin Fogarty - 12 Jul, 2018 - Comments: 1

By Kevin Fogarty and Ed Sperling The race is on to develop ways of testing autonomous vehicles to prove they are safe under most road conditions, but this has turned out to be much more difficult than initially thought. The autonomous vehicle technology itself is still in various stages of development, with carmakers struggling to fine-tune AI algorithms that can guide robots on wheels th... » read more

Power/Performance Bits: Feb. 7
By Jesse Allen - 07 Feb, 2017 - Comments: 1

Infrared links for data centers Researchers at Penn State, Stony Brook University and Carnegie Mellon University developed a free space optical link for communication in data centers using infrared lasers and receivers mounted on top of data center racks. According to Mohsen Kavehrad, professor of electrical engineering at Penn State, "It uses a very inexpensive lens, we get a very narrow... » read more

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