Dissolving The Barriers In Multi-Substrate 3D-IC Assembly Design

By Tarek Ramadan - 24 Feb, 2022 - Comments: 0

Advanced packaging continues to promise improved form factor, cost, performance, and functionality compared to the traditional transistor scaling on SoCs. This is done by integrating multiple dies on top of a substrate (organic or silicon). Besides multiple dies, multiple substrates can typically exist in a 3D-IC assembly. In this case, the benefits of advanced packaging are taken to a whole ne... » read more

Collaboration And Advanced Substrates

By Katherine Derbyshire - 08 Oct, 2018 - Comments: 0

Discussions of semiconductor manufacturing tend to focus on CMOS logic and memory devices, sometimes to the exclusion of everything else. Discussions of silicon-on-insulator wafer markets focus on the needs of high performance logic. Lithography analysts emphasize high density memories. It’s easy to forget that real systems contain other devices, too. A modern smartphone probably supports ... » read more

Substrates for Semiconductor Packaging

By SEMI - 16 Jan, 2012 - Comments: 0

2012 Market Outlook for Laminate and Leadframe Materials By Jan Vardaman, TechSearch International, and Dan Tracy, SEMI Combined, laminate substrates and leadframes will represent an estimated US$ 13.3 billion market in 2011 and is forecasted to reach $14 billion in 2012. This is larger than the revenues for silicon wafers (including silicon-on-insulator wafers) of $10.3 billion in 2011 and... » read more

How do PV and IC silicon markets compare?

By Katherine Derbyshire - 14 Feb, 2011 - Comments: 0

The recent announcement of 2010 silicon wafer shipments got me wondering: silicon consumption for solar cells passed silicon consumption for integrated circuits a number of years ago, but how do they compare now? A quick call to the very helpful Richard Winegarner at Sage Concepts answered the question. In 2009, solar cells consumed 10 times as many square inches, but generated about the same t... » read more

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tag: substrates

Dissolving The Barriers In Multi-Substrate 3D-IC Assembly Design

Collaboration And Advanced Substrates

Substrates for Semiconductor Packaging

How do PV and IC silicon markets compare?

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