Are You Ready For HBM4? A Silicon Lifecycle Management (SLM) Perspective


Many factors are driving system-on-chip (SoC) developers to adopt multi-die technology, in which multiple dies are stacked in a three-dimensional (3D) configuration. Multi-die systems may make power and thermal issues more complex, and they have required major innovations in electronic design automation (EDA) implementation and test tools. These challenges are more than offset by the advantages... » read more

Chip Industry Week in Review


Okinawa Institute of Science and Technology proposed a new EUV litho technology using only four reflective mirrors and a new method of illumination optics that it claims will use 1/10 the power and cost half as much as existing EUV technology from ASML. Applied Materials may not receive expected U.S. funding to build a $4 billion research facility in Sunnyvale, CA, due to internal government... » read more

Keeping Up With New ADAS And IVI SoC Trends


In the automotive industry, AI-enabled automotive devices and systems are dramatically transforming the way SoCs are designed, making high-quality and reliable die-to-die and chip-to-chip connectivity non-negotiable. This article explains how interface IP for die-to-die connectivity, display, and storage can support new developments in automotive SoCs for the most advanced innovations such as c... » read more

Chip Security Now Depends On Widening Supply Chain


Securing chips is becoming more challenging as SoCs are disaggregated into chiplets, creating new vulnerabilities that involve hardware and software, as well as multiple entities, and extending threats across a much broader supply chain. In the past, much of the cyber threat model was confined to either hardware or software, and where multiple vendors were involved, various chips were separa... » read more

Post-Quantum Computing Threatens Fundamental Transport Protocols


The Transport Level Security (TLS) protocol is one of the few rock-steady spots in the rapidly changing computing industry, but that's about to change as quantum computers threaten traditional encryption schemes. Because TLS is fundamental to network communications, including allowing Internet of Things (IoT) devices to function properly, researchers already are exploring both hardware and s... » read more

Defining Chip Threat Models To Identify Security Risks


Experts At The Table: As hardware weaknesses have become a major target for attackers, the race to find new ways to strengthen chip security has begun to heat up. But one-size does not fit all solution. To figure out what measures need to be taken, a proper threat model must be assessed. Semiconductor Engineering sat down with a panel of experts at the Design Automation Conference in San Franci... » read more

Blog Review: July 31


Cadence's Jasmine Makhija explains how to boost the performance of CXL 3.0 by using NOP (No Operation) Insertion Hints in latency-optimized 256B Flit Mode, which enables the system to quickly revert to the low-latency path after temporarily switching to a higher-latency path due to error correction needs. Synopsys' Robert Fey finds that by automatically and dynamically linking requirements a... » read more

Requirements and Best Practices for Trustworthy Automotive Semiconductors


The complexity of electronic systems supporting Advanced Driver Assistance Systems (ADAS), Highly Automated Driving (HAD), and in-vehicle infotainment is growing exponentially. This, together with the move from multiple domain-specific Electronic Control Units (ECUs) to a zonal architecture will require high-performance computing. Furthermore, new use cases for Battery Electric Vehicles (BEV) i... » read more

Chip Industry Week In Review


The U.S. Department of Commerce and Amkor Technology signed a deal to provide up to $400 million in funding, under the CHIPS and Science Act, to build a previously announced end-to-end advanced packaging plant. The combined funding is expected to total about $2 billion. The new facility will add some 2,000 jobs in Peoria, Arizona. The SK hynix Board approved its Yongin Semiconductor Cluster... » read more

Will AI Disrupt EDA?


Generative AI has disrupted search, it is transforming the computing landscape, and now it's threatening to disrupt EDA. But despite the buzz and the broad pronouncements of radical changes ahead, it remains unclear where it will have impact and how deep any changes will be. EDA has two primary roles — automation and optimization. Many of the optimization problems are NP hard, which means ... » read more

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