tag: Synopsys

Blog Review: Aug. 10
By Jesse Allen - 10 Aug, 2022 - Comments: 0

Siemens' Heather George provides a primer on 3D IC, including the problems it is trying to solve, what differentiates it from other multi-chip technologies, and some of the unique challenges in 3D integration. Cadence's Paul McLellan shares highlights from the Automobil Elektronik Kongress, including how the increasing amount of software in a car is driving disruption in the automotive suppl... » read more

Choosing The Right Photonic Device Design Software
By Synopsys - 10 Aug, 2022 - Comments: 0

There are many factors to consider before deciding which software to use for photonic device design. To narrow the field, it can be helpful to ask these key questions as you investigate and compare software functionality. • Does the software provide enough flexibility to model and analyze products that offer the best solution to likely and possible design goals? • Is the simulation ca... » read more

Are You Leaving Performance On The Table? Here Is One Sure Way To Find Out
By Nozar Nozarian - 09 Aug, 2022 - Comments: 0

Compute platforms are always hungry for more performance. This is a fact that we simply cannot escape. Whether you are targeting high performance computing, IoT, mobile, or the automotive market, you need to unlock the best performance for your specific workloads. This relentless quest for performance comes with an unwelcome side effect: system complexity. As hardware becomes more capable, the ... » read more

Making The Most Of Data Lakes
By Anne Meixner - 09 Aug, 2022 - Comments: 0

Having all the semiconductor data available is increasingly necessary for improving manufacturability, yield, and ultimately the reliability of end devices. But without sufficient knowledge of relationships between data from different processes and computationally efficient data structures, the value of any data is significantly reduced. In the semiconductor industry, reducing waste, decreas... » read more

Synopsys And Cerebras Systems
By Synopsys - 09 Aug, 2022 - Comments: 0

The Cerebras Systems Wafer-Scale Engine 2 (WSE-2) is by far the largest silicon product available, with a total silicon area of 46,225mm². It utilizes the maximum square of silicon that can be made out of a 300mm diameter wafer. The square of silicon contains 84 die that are 550mm² each. These die were stitched together using proprietary layers of interconnect, making a continuous compute fab... » read more

Where Are The Autonomous Cars?
By Marie C. Baca - 08 Aug, 2022 - Comments: 0

Are we there yet? Governments, consumers, and engineers alike want to know how close the automotive world is to producing a fully autonomous Level 5 vehicle. While some experts say such vehicles could hit the road in the next few years, they're a shrinking minority. Most forecasts say a truly self-driving car is at least a decade away — and maybe much longer, because it requires disruptive... » read more

More Than Random: Achieving Systematic ASIL D ISO 26262 Compliance For Automotive SoCs
By Ron DiGiuseppe - 04 Aug, 2022 - Comments: 0

Automakers are upgrading vehicle autonomy levels from Level2 Advanced Driving Assistance Systems (ADAS) to Level 2+ and Level 3 and evolving to full Highly Automated Driving (HAD) Level 4 and Level 5 with new safety critical applications. The new applications such as automatic emergency braking, lane keep aid, traffic sign recognition, surround view, drowsiness monitoring, and others improve sa... » read more

Transforming AppSec: The Top Three Ways To Build Security Into DevOps
By Synopsys - 03 Aug, 2022 - Comments: 0

DevOps has changed the way organizations bring software to market, allowing them to deliver new applications and features rapidly and continuously. But it’s also introduced new security challenges as testing and remediation have failed to keep pace. As a result, cybercriminals have developed new attack strategies that intensify their focus on the application layer, including open source and s... » read more

Blog Review: Aug. 3
By Jesse Allen - 03 Aug, 2022 - Comments: 0

Siemens' Patrick Hope explains the growing importance of choosing the right laminate for PCB designs and how to read a material datasheet to compare important electrical, thermal, and mechanical properties. Synopsys' Yankin Tanurhan argues that as the number of sensors being integrated in automotive systems increases to enable new ADAS and autonomy capabilities, building security and quality... » read more

Need Design Talent? Create a Contest
By Marie C. Baca - 02 Aug, 2022 - Comments: 0

Amid a labor crunch for qualified engineers, semiconductor ecosystem participants are coming up with new strategies to entice university students, such as design competitions. In one design competition sponsored by Renesas earlier this year for European university students and their educators, teams were tasked with building a self-guided robot that could drive along a track in a virtual sim... » read more

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