tag: Synopsys

Standardizing Chiplet Interconnects
By John Koon - 23 May, 2022 - Comments: 0

The chip industry is making progress on standardizing the infrastructure for chiplets, setting the stage for faster and more predictable integration of different functions and features from different vendors. The ability to choose from a menu of small, highly specialized chips, and to mix and match them for specific applications and use cases, has been on the horizon for more than a decade. ... » read more

Week In Review: Manufacturing, Test
By Linda Christensen - 20 May, 2022 - Comments: 0

GlobalFoundries launched GF Labs, an “open framework of internal and external research and development initiatives that deliver a differentiated pipeline of market-driven process technology solutions for future data-centric, connected, intelligent and secure applications.” Greg Bartlett, GF's senior vice president of technology, engineering at quality, said the goal is to develop and exp... » read more

Week In Review: Design, Low Power
By Jesse Allen - 20 May, 2022 - Comments: 0

Cadence's digital full flow was certified for the GlobalFoundries 12LP/12LP+ process platforms. The certified tools include the Innovus Implementation System, Genus Synthesis Solution, Tempus Timing Signoff Solution, Voltus IC Power Integrity Solution, Quantus Extraction Solution, Litho Physical Analyzer (LPA), and Pegasus Verification System. Siemens Digital Industries Software's Calibre nm... » read more

Week In Review: Auto, Security, Pervasive Computing
By Susan Rambo - 20 May, 2022 - Comments: 0

Automotive, mobility The number new energy vehicles (NEVs) sold went up 80% from year over year, says TrendForce in its review of market for Q1 2022. NEVs are battery electric vehicles (BEVs), plug-in hybrid electric vehicles (PHEVs), and fuel cell vehicles. Over 2.004 million units sold in the first quarter of 2022 (1Q22), with BEVs making the strongest showing at 1.508 million units, a 271% ... » read more

Bridging IC Design, Manufacturing, And In-Field Reliability
By Ed Sperling - 18 May, 2022 - Comments: 0

Experts at the Table: Semiconductor Engineering sat down to talk about silicon lifecycle management and how that can potentially glue together design, manufacturing, and devices in the field, with Prashant Goteti, principal engineer at Intel; Rob Aitken, R&D fellow at Arm; Zoe Conroy, principal hardware engineer at Cisco; Subhasish Mitra, professor of electrical engineering and computer sci... » read more

Blog Review: May 18
By Jesse Allen - 18 May, 2022 - Comments: 0

Coventor's Gerold Schropfer considers taking an approach from the early days of computing and using MEMS technology to create computers based on micro-scale electro-mechanical logic and memory for emerging low-energy computing applications such as autonomous sensor nodes and edge computing. Synopsys' Morten Christiansen explains how USB4 differs from USB 3.2, allowing simultaneous host-to-ho... » read more

DRAM Choices Becoming Central Design Considerations
By Ann Mutschler - 12 May, 2022 - Comments: 0

Chipmakers are paying much closer attention to various DRAM options as they grapple with what goes on-chip or into a package, elevating attached memory to a critical design element that can affect system performance, power, and cost. These are increasingly important issues to sort through with a number of tradeoffs, but the general consensus is that to reach the higher levels of performance ... » read more

Improving PPA With AI
By John Koon - 12 May, 2022 - Comments: 0

AI/ML/DL is starting to show up in EDA tools for a variety of steps in the semiconductor design flow, many of them aimed at improving performance, reducing power, and speeding time to market by catching errors that humans might overlook. It's unlikely that complex SoCs, or heterogeneous integration in advanced packages, ever will be perfect at first silicon. Still, the number of common error... » read more

Meeting 112 SerDes Based System Design Challenges
By Madhumita Sanyal - 12 May, 2022 - Comments: 0

The need for higher bandwidth networking equipment as well as connectivity in the cloud and hyperscale data centers is driving the switch technology transition from 25Tb/s (terabytes) to 51Tb/s and soon to 100Tb/s. The industry has chosen Ethernet to drive the switch market, using 112G SerDes or PHY technology today and 224G SerDes in the future. This article describes how designers can overcom... » read more

Software-Defined Cars
By Ann Mutschler - 11 May, 2022 - Comments: 0

Automotive architectures are becoming increasingly software-driven, a shift that simplifies upgrades and makes it easier to add new features into vehicles. All of this is enabled by the increasing digitalization of automotive functions and features, shifting from mechanical to electrical design, and increasingly from analog to digital data. That enables OEMs to add or up-sell features years ... » read more

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