Next-Generation Distributed Static Timing Analysis On The Cloud

By Ajit Sequeira - 26 May, 2022 - Comments: 0

Ever-growing chip size and complexity put pressure on every step and every electronic design automation (EDA) tool in the development flow. More decisions must be made at the architectural stage, stressing virtual prototypes and high-level models. Simulations become slower and consume more memory. Formal verification struggles to achieve full proofs. Logic synthesis and layout have a harder tim... » read more

Designing Application-Specific Processors for Wireless 5G SoCs

By Synopsys - 25 May, 2022 - Comments: 0

Traditional architectures for wireless baseband applications are no longer adequate for recent and next-generation modem standards. Supporting complex and still evolving standards like 5G in a single modem is only possible by using SDR techniques, which place increasing demands on performance and power consumption on the SoC. ASIP architectures enable full customization of a processor, which... » read more

Blog Review: May 25

By Jesse Allen - 25 May, 2022 - Comments: 0

Coventor's Michael Hargrove points to the need for a new generation of deep-submicron CMOS circuits that can operate at deep-cryogenic temperatures to achieve a quantum integrated circuit where the array of qubits is integrated on the same chip as the CMOS electronics required to read the state of the qubits. Ansys' Marc Swinnen warns about dynamic voltage drop as ultra-low supply voltages, ... » read more

Embedded Software: Sometimes Easier, Often More Complex

By Ann Mutschler - 25 May, 2022 - Comments: 0

Embedded software, once a challenge to write, update, and optimize, is following the route of other types of software. It is abstracted, simpler to use, and much faster to write. But in some cases, it's also much harder to get right. From a conceptual level, the general definition of embedded software has not changed much. It's still low-level drivers and RTOSes that run close to the hardwar... » read more

Standardizing Chiplet Interconnects

By John Koon - 23 May, 2022 - Comments: 0

The chip industry is making progress on standardizing the infrastructure for chiplets, setting the stage for faster and more predictable integration of different functions and features from different vendors. The ability to choose from a menu of small, highly specialized chips, and to mix and match them for specific applications and use cases, has been on the horizon for more than a decade. ... » read more

Week In Review: Manufacturing, Test

By Linda Christensen - 20 May, 2022 - Comments: 0

GlobalFoundries launched GF Labs, an “open framework of internal and external research and development initiatives that deliver a differentiated pipeline of market-driven process technology solutions for future data-centric, connected, intelligent and secure applications.” Greg Bartlett, GF's senior vice president of technology, engineering at quality, said the goal is to develop and exp... » read more

Week In Review: Design, Low Power

By Jesse Allen - 20 May, 2022 - Comments: 0

Cadence's digital full flow was certified for the GlobalFoundries 12LP/12LP+ process platforms. The certified tools include the Innovus Implementation System, Genus Synthesis Solution, Tempus Timing Signoff Solution, Voltus IC Power Integrity Solution, Quantus Extraction Solution, Litho Physical Analyzer (LPA), and Pegasus Verification System. Siemens Digital Industries Software's Calibre nm... » read more

Week In Review: Auto, Security, Pervasive Computing

By Susan Rambo - 20 May, 2022 - Comments: 0

Automotive, mobility The number new energy vehicles (NEVs) sold went up 80% from year over year, says TrendForce in its review of market for Q1 2022. NEVs are battery electric vehicles (BEVs), plug-in hybrid electric vehicles (PHEVs), and fuel cell vehicles. Over 2.004 million units sold in the first quarter of 2022 (1Q22), with BEVs making the strongest showing at 1.508 million units, a 271% ... » read more

Bridging IC Design, Manufacturing, And In-Field Reliability

By Ed Sperling - 18 May, 2022 - Comments: 0

Experts at the Table: Semiconductor Engineering sat down to talk about silicon lifecycle management and how that can potentially glue together design, manufacturing, and devices in the field, with Prashant Goteti, principal engineer at Intel; Rob Aitken, R&D fellow at Arm; Zoe Conroy, principal hardware engineer at Cisco; Subhasish Mitra, professor of electrical engineering and computer sci... » read more

Blog Review: May 18

By Jesse Allen - 18 May, 2022 - Comments: 0

Coventor's Gerold Schropfer considers taking an approach from the early days of computing and using MEMS technology to create computers based on micro-scale electro-mechanical logic and memory for emerging low-energy computing applications such as autonomous sensor nodes and edge computing. Synopsys' Morten Christiansen explains how USB4 differs from USB 3.2, allowing simultaneous host-to-ho... » read more

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Knowledge Centers
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Defining The Chiplet Socket

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tag: Synopsys

Next-Generation Distributed Static Timing Analysis On The Cloud

Designing Application-Specific Processors for Wireless 5G SoCs

Blog Review: May 25

Embedded Software: Sometimes Easier, Often More Complex

Standardizing Chiplet Interconnects

Week In Review: Manufacturing, Test

Week In Review: Design, Low Power

Week In Review: Auto, Security, Pervasive Computing

Bridging IC Design, Manufacturing, And In-Field Reliability

Blog Review: May 18

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