Variation At 10/7nm

By Ed Sperling - 18 Oct, 2018 - Comments: 1

Klaus Schuegraf, vice president of new products and solutions at PDF Solutions, explains why variability is a growing challenge at advanced nodes, why middle of line is now one of the big problem areas, and what happens when a via is misaligned due to a small process variation. https://youtu.be/jQfggOnxZJQ » read more

Why Test Costs Will Increase

By Ed Sperling - 08 Oct, 2018 - Comments: 0

The economics of test are under siege. Long seen as a necessary but rather mundane step in ensuring chip quality, or a way of testing circuitry from the inside while it is still in use, manufacturers and design teams have paid little attention to this part of the design-through-manufacturing flow. But problems have been building for some time in three separate areas, and they could have a b... » read more

Sorting Out Packaging Options

By Ed Sperling - 10 Sep, 2018 - Comments: 0

Semiconductor Engineering sat down to discuss advanced packaging with David Butler, executive vice president and general manager of SPTS Technologies; Ingu Yin Chang, senior vice president president at ASE Group; Hubert Karl Lakner, executive director of the Fraunhofer Institute for Photonic Microsystems; Robert Lo, division director for electronics and optoelectronics research at Industrial Te... » read more

Embedded Flash Scaling Limits

By Mark LaPedus - 19 Jul, 2018 - Comments: 3

Embedded nonvolatile flash memory has played a key role in chips for years, but the technology is beginning to face some scaling and cost roadblocks and it’s not clear what comes next. Embedded flash is used in several markets, such as automotive, consumer and industrial. But the automotive sector appears to be the most concerned about the future of the technology. Typically, a car incorpo... » read more

Bridges Vs. Interposers

By Mark LaPedus - 12 Jul, 2018 - Comments: 4

The number of technology options continue to grow for advanced packaging, including new and different ways to incorporate so-called silicon bridges in products. For some time, Intel has offered a silicon bridge technology called Embedded Multi-die Interconnect Bridge (EMIB), which makes use of a tiny piece of silicon with routing layers that connects one chip to another in an IC package. In ... » read more

System-In-Package Vs. eNVM

By Yafeng Zhang - 21 Jun, 2018 - Comments: 0

The booming automotive and IoT markets are driving increasing demand for microcontrollers (MCUs). Recent forecasts project that the overall MCU compound annual growth rate (CAGR) will reach 4% over the next five years, and in particular the automotive MCU CAGR could reach close to 14%. Non-volatile memory (NVM) is a critical element of MCUs, as it is needed not only to store the code, but al... » read more

Tech Talk: MCU Memory Options

By Ed Sperling - 17 May, 2018 - Comments: 0

David Eggleston, vice president of embedded memory at GlobalFoundries, talks about the pros and cons of embedded non-volatile memory versus system in package. https://youtu.be/6KoQTFbFVCo » read more

OSAT Consolidation Continues

By Jeff Dorsch - 14 May, 2018 - Comments: 0

Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries Ltd. (SPIL) are beginning the process of uniting the two companies, which are among the largest outsourced semiconductor assembly and testing contractors in the world. For now, the companies will continue to operate separately, while their shares are traded under the ASX symbol on the New York Stock Exchange. ASE I... » read more

MIS Packaging Takes Off

By Mark LaPedus - 07 May, 2018 - Comments: 0

Momentum is building for IC packages based on an emerging technology called molded interconnect substrate (MIS). ASE, Carsem, JCET/STATS ChipPAC, Unisem and others are developing IC packages based on MIS substrate technology, which is ramping up in the analog, power IC and even the cryptocurrency markets. MIS starts with a specialized substrate material for select IC packages. The MIS sub... » read more

Embedded Die Packaging Emerges

By Mark LaPedus - 09 Apr, 2018 - Comments: 1

Embedded die packaging is seeing renewed demand amid the push towards chips and systems that require smaller form factors. ASE, AT&S, GE, Shinko, Taiyo Yuden, TDK, Würth Elektronik and others compete in the merchant embedded die packaging market, according to Yole Développement. In fact, ASE and TDK have a joint venture in the arena, which is beginning to ramp up production. Additional... » read more

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Knowledge Centers
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