A look at the tradeoffs between embedded NVM and system in package.
David Eggleston, vice president of embedded memory at GlobalFoundries, talks about the pros and cons of embedded non-volatile memory versus system in package.
Companies battle it out to get artificial intelligence to the edge using various chip architectures as their weapons of choice.
Bulk CMOS, FD-SOI and finFETs all on tap as big players vie for differentiation. But where will chipmakers go after 28nm?
Consortiums seek ways to ensure interoperability of hardened IP as way of cutting costs, time-to-market, but it’s not going to be easy.
Experts at the Table, Part 1: Impact on the supply chain, who’s using advanced packaging, and the cost of packaging versus device scaling.
While CPUs continue to evolve, performance is no longer limited to a single processor type or process geometry.
AI-enabled systems are being designed to process more data locally as device scaling benefits decline.
Semiconductor devices face many hazards before and after manufacturing that can cause them to fail prematurely.
Interest in the open-source ISA marks a significant shift among chipmakers, but it will require continued industry support to be successful.
Foundry forms ASIC subsidiary as it focuses on 14nm/12nm and above.
Market overcrowding, more efficient manufacturing, and growing list of scaling issues create a challenging competitive landscape.
Chips will cost more to design and manufacture even without pushing to the latest node, but that’s not the whole story.
Slowdown due to impact on timing, and dependencies between power, thermal and timing that may not be caught by signoff tools.
Why auto tech companies are so concerned about interactions with humans.
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