A look at the tradeoffs between embedded NVM and system in package.
David Eggleston, vice president of embedded memory at GlobalFoundries, talks about the pros and cons of embedded non-volatile memory versus system in package.
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Half nodes, different transistor types, and numerous other options are adding uncertainty everywhere.
Why multi-die solutions are getting so much attention these days.
Technology offers improved brightness, colors, and lower power, but they’re expensive and difficult to manufacture.
Wave of new options under development as scaling runs out of steam.
As endpoint architectures get more complicated, EDA tool becomes key tool for experimenting with different options.
The promise of advanced packaging is being able to integrate heterogeneous chips, but a lot of work is needed to make that happen.
Better algorithms and more data could bolster adoption, particularly at advanced nodes.
Combining the flexibility of a FPGA with the performance and cost benefits of an SoC is pushing this technology well into the mainstream.
Why this choice isn’t as obvious as it might look.
Improvement still needed for uptime, defectivity, line edge roughness and process flows.
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Interests: System-Level Design Low Power-High Performance Manufacturing, Packaging & Materials Test, Measurement & Analytics IoT, Security & Automotive
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