A look at the tradeoffs between embedded NVM and system in package.
David Eggleston, vice president of embedded memory at GlobalFoundries, talks about the pros and cons of embedded non-volatile memory versus system in package.
Upcoming versions of high-bandwidth memory are thermally challenging, but help may be on the way.
Sensor technologies are still evolving, and capabilities are being debated.
Wireless technology is getting faster and more reliable, but it’s also becoming more challenging to support all of the necessary protocols.
Price parity with silicon modules, increased demand in EVs, and more capacity are driving widespread adoption.
First systems built, with production planned for 2025; hyper-NA to follow next decade.
Photonics, sustainability, and AI chips draw investment; 157 companies raised over $2.4 billion.
Getting this wrong can increase power and cost, while reducing performance.
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