A look at the tradeoffs between embedded NVM and system in package.
David Eggleston, vice president of embedded memory at GlobalFoundries, talks about the pros and cons of embedded non-volatile memory versus system in package.
Rising costs and gaps in equipment emerge as technology scales; new tools under development.
Explosion of data is forcing significant changes in where processing is done.
Experts at the Table, part 1: Shrinking features isn’t enough anymore. The big challenge now is how to achieve economies of scale and minimize complex integration issues.
New market opportunities and global competitiveness are limited by qualified people.
Researchers digging into ways around the von Neumann bottleneck.
The promise of advanced packaging is being able to integrate heterogeneous chips, but a lot of work is needed to make that happen.
Better algorithms and more data could bolster adoption, particularly at advanced nodes.
30 facilities planned, including 10/7nm processes, but trade war and economic factors could slow progress.
New architectures, packaging approaches gain ground as costs increase, but shrinking features continues to play a role.
Improvement still needed for uptime, defectivity, line edge roughness and process flows.
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