tag: Teradyne

Enablers And Barriers For Connecting Diverse Data
By Anne Meixner - 09 Nov, 2021 - Comments: 0

More data is being collected at every step of the manufacturing process, raising the possibility of combining data in new ways to solve engineering problems. But this is far from simple, and combining results is not always possible. The semiconductor industry’s thirst for data has created oceans of it from the manufacturing process. In addition, semiconductor designs large and small now ha... » read more

Coping With Parallel Test Site-to-Site Variation
By Anne Meixner - 09 Nov, 2021 - Comments: 1

Testing multiple devices in parallel using the same ATE results in reduced test time and lower costs, but it requires engineering finesse to make it so. Minimizing test measurement variation for each device under test (DUT) is a multi-physics problem, and it's one that is becoming more essential to resolve at each new process node and in multi-chip packages. It requires synchronization of el... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 29 Oct, 2021 - Comments: 0

Chipmakers After years in the works, GlobalFoundries is finally a public company. But on its first day of trading on Thursday (Oct. 28), shares of the foundry vendor slipped a bit. GF finished its first day of trading at $46.40. This compares to the $47 per share it priced in the initial public offering (IPO), according a report to Reuters. The chipmaker has a market capitalization of about $2... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 15 Oct, 2021 - Comments: 0

Chipmakers TSMC posted its results for the quarter and confirmed its long-awaited plans to build a fab in Japan. It’s not a leading-edge fab, but rather a plant for 28nm/22nm processes. “The company confirmed plans to build a new fab in Japan for 22nm + 28nm,” said Aaron Rakers, an analyst at Wells Fargo, in a research note. “An average 22/28nm fab costs ~$4-5B range per 45k wspm. Fab ... » read more

PCB And IC Technologies Meet In The Middle
By Bryon Moyer - 12 Oct, 2021 - Comments: 1

Surface-mount technology (SMT) is evolving far beyond its roots as a way of assembling packaged chips onto printed circuit boards without through-holes. It is now moving inside packages that will themselves be mounted on PCBs. But SMT for advanced packages isn’t the same as the SMT we’ve been used to. “Many systems include multiple ASICs, a lot of memory, and that's all integrated i... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 01 Oct, 2021 - Comments: 0

Market research For some time, the semiconductor industry has experienced acute shortages. The automotive industry has suffered the most. When will this all end? “Shortages have become more acute for many products in the near term because the growth in demand is greater than the increase in wafer and packaging capacity that was anticipated by the foundry and semiconductor vendors. To date... » read more

Making Test Transparent With Better Data
By Susan Rambo - 07 Sep, 2021 - Comments: 0

Data is critical for a variety of processes inside the fab. The challenge is getting enough consistent data from different equipment and then plugging it back into the design, manufacturing, and test flows to quickly improve the process and uncover hard-to-find defective die. Progress is being made. The inspection and test industry is on the cusp of having more dynamic ways to access the dat... » read more

5G Chips Add Test Challenges
By Bryon Moyer - 06 Jul, 2021 - Comments: 1

The advent of chips supporting millimeter-wave (mmWave) 5G signals is creating a new set of design and testing challenges. Effects that could be ignored at lower frequencies are now important. Performing high-volume test of RF chips will require much more from automated test equipment (ATE) than is required for chips operating below 6 GHz. “MmWave design is a pretty old thing,” said Y... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 30 Apr, 2021 - Comments: 0

Chipmakers and OEMs Intel wants $9.7 billion in subsidies for use in building a leading-edge fab in Europe, according to a report from Reuters. As reported, in March, Intel re-entered the foundry business, positioning itself against Samsung and TSMC at the leading edge, and against a multitude of foundries working at older nodes. Eighteen members of the European Union recently launched an ... » read more

Preventing Chips From Burning Up During Test
By Bryon Moyer - 09 Mar, 2021 - Comments: 1

It’s become increasingly difficult to manage the heat generated during IC test. Absent the proper mitigations, it’s easy to generate so much heat that probe cards and chips literally can burn up. As a result, implementing temperature-management techniques is becoming a critical part of IC testing. “We talk about systems, saying the system is good,” said Arun Krishnamoorthy, senior... » read more

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