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What’s Before Stacked Die?


By Mark LaPedus Advanced 2.5D/3D chip stacking has a number of challenges and is still a few years away from mass production. In fact, mass production may not occur until 2015 or 2016. But OEMs can ill afford to sit still and wait for 2.5D/3D technology to mature. So, until 2.5D/3D is ready for prime time, chipmakers and IC-packaging houses are under pressure to innovate and extend current ... » read more

Experts At The Table: Stacked Die And The Supply Chain


By Ed Sperling Semiconductor Manufacturing & Design sat down to discuss the effects of stacking die on the supply chain with Stephen Pateras, production marketing director for silicon test at Mentor Graphics; Javier DeLaCruz, director of manufacturing technology at eSilicon; Colin Baldwin, director of marketing at Open-Silicon; Charles Woychik, director of marketing and technical analysis ... » read more

Experts At The Table: Stacked Die And The Supply Chain


By Ed Sperling Semiconductor Manufacturing & Design sat down to discuss the effects of stacking die on the supply chain with Stephen Pateras, production marketing director for silicon test at Mentor Graphics; Javier DeLaCruz, director of manufacturing technology at eSilicon; Colin Baldwin, director of marketing at Open-Silicon; Charles Woychik, director of marketing and technical analysis ... » read more

Experts At The Table: Stacked Die And The Supply Chain


By Ed Sperling Semiconductor Manufacturing & Design sat down to discuss the effects of stacking die on the supply chain with Stephen Pateras, production marketing director for silicon test at Mentor Graphics; Javier DeLaCruz, director of manufacturing technology at eSilicon; Colin Baldwin, director of marketing at Open-Silicon; Charles Woychik, director of marketing and technical analysis... » read more

The Impact of 3D Packaging


With semiconductor packaging becoming a more crucial piece of the Moore’s Law roadmap, the industry is still sorting out the impact of a 3D design and packaging approach on design time, cost and power. 3D is now commonly used for high volume applications such as cell phones and SD cards, and is accomplished at the packaging step either through chip stacking or package-on-package (PoP) stac... » read more

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