Chip Industry Week In Review

By The SE Staff - 19 Apr, 2024 - Comments: 0

SK hynix and TSMC plan to collaborate on HBM4 development and next-generation packaging technology, with plans to mass produce HBM4 chips in 2026. The agreement is an early indicator for just how competitive, and potentially lucrative, the HBM market is becoming. SK hynix said the collaboration will enable breakthroughs in memory performance with increased density of the memory controller at t... » read more

Research Bits: July 5

By Susan Rambo - 05 Jul, 2023 - Comments: 0

UTe2 breakthrough for quantum computing Scientists from the Macroscopic Quantum Matter Group laboratory at the University College Cork (UCC) in Ireland discovered a spatially modulating superconducting state in the superconductor uranium ditelluride (UTe2) that could be useful as in topological quantum computing. Using a powerful quantum microscope, the team found that the some of the electro... » read more

Week In Review: Semiconductor Manufacturing, Test

By Gregory Haley - 07 Apr, 2023 - Comments: 0

South Korea slashed chip production in February by 17.7% compared to the previous month — 41.8% year-over-year, and the sharpest drop since 2008 — according to figures from South Korea’s National Statistics Office. Inventories were up 33.5%, while exports dropped by 41.6%. China launched a security probe into U.S. memory chipmaker Micron in apparent retaliation for U.S. restrictions on... » read more

Chip Industry’s Technical Paper Roundup: Dec. 5

By Linda Christensen - 05 Dec, 2022 - Comments: 0

New technical papers added to Semiconductor Engineering’s library this week. [table id=67 /] If you have research papers you are trying to promote, we will review them to see if they are a good fit for our global audience. At a minimum, papers need to be well researched and documented, relevant to the semiconductor ecosystem, and free of marketing bias. There is no cost involved for u... » read more

Hardware Trojans Target Coherence Systems in Chiplets (Texas A&M / NYU)

By Technical Paper Link - 01 Dec, 2022 - Comments: 0

A technical paper titled "Hardware Trojan Threats to Cache Coherence in Modern 2.5D Chiplet Systems" was published by researchers at Texas A&M University and NYU. Abstract: "As industry moves toward chiplet-based designs, the insertion of hardware Trojans poses a significant threat to the security of these systems. These systems rely heavily on cache coherence for coherent data communic... » read more

Week In Review: Manufacturing, Test

By Ed Sperling - 25 Mar, 2022 - Comments: 0

Worldwide fab equipment spending for front-end manufacturing is expected to hit $107 billion this year, an 18% year-over-year increase, according to SEMI’s latest World Fab Forecast report. “Crossing the $100 billion mark in spending on global fab equipment for the first time is a historic milestone for the semiconductor industry,” said Ajit Manocha, president and CEO of SEMI. Investme... » read more

Communication Algorithm-Architecture Co-Design for Distributed Deep Learning

By Technical Paper Link - 14 Jun, 2021 - Comments: 0

"Abstract—Large-scale distributed deep learning training has enabled developments of more complex deep neural network models to learn from larger datasets for sophisticated tasks. In particular, distributed stochastic gradient descent intensively invokes all-reduce operations for gradient update, which dominates communication time during iterative training epochs. In this work, we identify th... » read more

System Bits: Aug. 16

By Ann Mutschler - 16 Aug, 2016 - Comments: 0

Record-breaking quantum logic gate Reaching the benchmark required theoretically to build a quantum computer, University of Oxford researchers have achieved a quantum logic gate with record-breaking 99.9% precision. They reminded that quantum computers, which function according to the laws of quantum physics, have the potential to dwarf the processing power of today's computers, able to pro... » read more

Manufacturing Bits: Dec. 8

By Mark LaPedus - 08 Dec, 2014 - Comments: 1

Progress report on EUV resists The development of resists is a key part of extreme ultraviolet (EUV) lithography. “EUV resists are production ready,” said Kevin Cummings, Sematech’s director of lithography. “However, through Sematech’s work with the resist suppliers, we have observed a deceleration in the rate of improvements. As a result, Sematech is working not only with the re... » read more

Manufacturing Bits: April 15

By Mark LaPedus - 15 Apr, 2014 - Comments: 0

Self-assembled nano-walls Using a self-assembly process, Texas A&M University and the International Institute for Carbon-Neutral Energy Research have devised a new technology called “nano-walls.” [caption id="attachment_11488" align="alignnone" width="499"] Researchers use common spray gun to create self-assembling nanoparticle films. (Source: Texas A&M).[/caption] Researcher... » read more

tag: Texas A&M