Development Of An Extremely High Thermal Conductivity TIM For Large Electronics Packages In 4th Industrial Revolution Era


The capability and diversity of high-performance microprocessors is increasing with each process technology generation to meet increasing application demands. The cooling designs for these chips must deal with larger temperature gradients across the die than previous generations. Dissipation of the thermal energy from heat generating parts to a heat sink via conduction occurs through a thermal ... » read more

Power/Performance Bits: Oct. 8


How light interacts with gold nanostructures With the potential to possibly increase the efficiency of solar cells and photo detectors, University of Manchester researchers have discovered that graphene can be used to investigate how light interacts with nano-antennas. The team, which also included researchers from Freie Universität Berlin and Imperial College London, have shown that graph... » read more