Next Gen Laser Assisted Bonding (LAB) Technology

By SeokHo Na - 18 May, 2023 - Comments: 0

In the semiconductor market, there are many applications including smartphone, tablets, central processing units (CPUs), artificial intelligence (AI), data cloud and more that are expecting rapid growth. Among them, CPU data processing, AI and data cloud require much higher power consumption than smart phones or tablets. For the higher power applications, Flip Chip ball grid array (FCBGA) or 2.... » read more

Preventing Chips From Burning Up During Test

By Bryon Moyer - 09 Mar, 2021 - Comments: 1

It’s become increasingly difficult to manage the heat generated during IC test. Absent the proper mitigations, it’s easy to generate so much heat that probe cards and chips literally can burn up. As a result, implementing temperature-management techniques is becoming a critical part of IC testing. “We talk about systems, saying the system is good,” said Arun Krishnamoorthy, senior... » read more

Development Of An Extremely High Thermal Conductivity TIM For Large Electronics Packages In 4th Industrial Revolution Era

By Amkor - 17 Feb, 2020 - Comments: 0

The capability and diversity of high-performance microprocessors is increasing with each process technology generation to meet increasing application demands. The cooling designs for these chips must deal with larger temperature gradients across the die than previous generations. Dissipation of the thermal energy from heat generating parts to a heat sink via conduction occurs through a thermal ... » read more

Power/Performance Bits: Oct. 8

By Ann Mutschler - 08 Oct, 2013 - Comments: 0

How light interacts with gold nanostructures With the potential to possibly increase the efficiency of solar cells and photo detectors, University of Manchester researchers have discovered that graphene can be used to investigate how light interacts with nano-antennas. The team, which also included researchers from Freie Universität Berlin and Imperial College London, have shown that graph... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

NAND Flash Targets 1,000 Layers

New techniques go beyond improved deposition and etching, but challenges stack up, too.

by Bryon Moyer

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: thermal interface material

Next Gen Laser Assisted Bonding (LAB) Technology

Preventing Chips From Burning Up During Test

Development Of An Extremely High Thermal Conductivity TIM For Large Electronics Packages In 4th Industrial Revolution Era

Power/Performance Bits: Oct. 8