tag: thermal management

Monolithic Microfluidic Cooling on a Functional CPU Running Real-World Benchmarks
By Technical Paper Link - 25 Jul, 2022 - Comments: 0

New technical paper titled "Integrated Silicon Microfluidic Cooling of a High-Power Overclocked CPU for Efficient Thermal Management" is published by researchers at Georgia Tech and Microsoft. According to the abstract: "In this work, we use micropin-fins etched directly on the back of an Intel Core i7-8700K CPU and overclocked it to dissipate up to 215W of power while being cooled by room... » read more

Thermal Cycling Failure In Electronics
By Kelly Morgan - 19 Jul, 2022 - Comments: 0

Each time a device is turned off and on, its temperature changes. (Just think about how often your phone lights up all day.) Energy flowing through several layers of tightly stacked materials causes devices to heat up, then rapidly cool down. This repeated oscillation between temperatures over the lifetime of a device is called thermal cycling. Why thermal management is important Thermal cycl... » read more

Thermal Management Challenges and Requirements of 3 types of Microelectronic Devices
By Technical Paper Link - 20 Jun, 2022 - Comments: 0

New technical paper titled "A Review on Transient Thermal Management of Electronic Devices" from researchers at Indian Institute of Technology Bombay. Abstract "Much effort in the area of electronics thermal management has focused on developing cooling solutions that cater to steady-state operation. However, electronic devices are increasingly being used in applications involving time-varyi... » read more

Review of Bumpless Build Cube Using Wafer-on-Wafer & Chip-on-Wafer for Tera-Scale 3D Integration
By Technical Paper Link - 20 Jun, 2022 - Comments: 0

New research paper titled "Review of Bumpless Build Cube (BBCube) Using Wafer-on-Wafer (WOW) and Chip-on-Wafer (COW) for Tera-Scale Three-Dimensional Integration (3DI)" from researchers at Tokyo Institute of Technology and others. Abstract "Bumpless Build Cube (BBCube) using Wafer-on-Wafer (WOW) and Chip-on-Wafer (COW) for Tera-Scale Three-Dimensional Integration (3DI) is discussed. Bum... » read more

Thermal Floorplanning For Chips
By Brian Bailey - 10 Jun, 2021 - Comments: 0

Heat management is becoming crucial to an increasing number of chips, and it's one of a growing number of interconnected factors that must be considered throughout the entire development flow. At the same time, design requirements are exacerbating thermal problems. Those designs either have to increase margins or become more intelligent about the way heat is generated, distributed, and dissi... » read more

Mapping Heat Across A System
By Ann Mutschler - 13 May, 2021 - Comments: 0

Thermal issues are becoming more difficult to resolve as chip features get smaller and systems get faster and more complex. They now require the integration of technologies from both the design and manufacturing flows, making design for power and heat a much broader problem. This is evident with the evolution of a smart phone. Phones sold 10 years ago were very different devices. Functionali... » read more

Recent Advances in Thermal Metamaterials and Their Future Applications for Electronics Packaging
By Technical Paper Link - 31 Mar, 2021 - Comments: 0

Abstract: "Thermal metamaterials exhibit thermal properties that do not exist in nature but can be rationally designed to offer unique capabilities of controlling heat transfer. Recent advances have demonstrated successful manipulation of conductive heat transfer and led to novel heat guiding structures such as thermal cloaks, concentrators, etc. These advances imply new opportunities to gui... » read more

Development Of An Extremely High Thermal Conductivity TIM For Large Electronics Packages In 4th Industrial Revolution Era
By Amkor - 17 Feb, 2020 - Comments: 0

The capability and diversity of high-performance microprocessors is increasing with each process technology generation to meet increasing application demands. The cooling designs for these chips must deal with larger temperature gradients across the die than previous generations. Dissipation of the thermal energy from heat generating parts to a heat sink via conduction occurs through a thermal ... » read more

Thermal Challenges And Moore’s Law
By Ed Sperling - 22 Oct, 2019 - Comments: 0

Steven Woo, fellow and distinguished inventor at Rambus, looks at the evolution of graphics cards over a couple of decades and how designs changed to deal with more graphics and more heat, and why smaller, faster and cheaper doesn’t apply in this market. » read more

A Complete Guide To Enclosure Thermal Design… 14 Key Considerations
By Mentor, a Siemens Business - 21 Feb, 2018 - Comments: 0

Enclosure design is an important aspect of system level thermal management to ensure electronics performance and reliability. Learn how to improve enclosure design in this guide covering 14 considerations on thermal management best practice. Examples of areas to focus on for advantages in cooling efficiency are illustrated and where tradeoff decisions are needed. Newly updated as of 2018, this... » read more

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