tag: thermal

Chiplet Placer with Thermal Consideration for 2.5D ICs
By Technical Paper Link - 27 Feb, 2023 - Comments: 0

A new technical paper titled "Chiplet Placement for 2.5D IC with Sequence Pair Based Tree and Thermal Consideration" was published by researchers at National Yang Ming Chiao Tung University (Taiwan). Abstract "This work develops an efficient chiplet placer with thermal consideration for 2.5D ICs. Combining the sequence-pair based tree, branch-and-bound method, and advanced placement/pruning... » read more

When Less Can Be More With Smart Module Design: Part 1
By Jan Baurichter - 06 Feb, 2023 - Comments: 0

Size and power often seem like opposite sides of a coin. When you reduce size – one of the ever-pressing goals in our industry – you inevitably reduce power. But does that have to be the case? By shifting our thinking from the chip to the module design, there’s no need to flip a coin. In IGBT modules, chip shrinkage leads to an increased thermal impedance, which then impacts performanc... » read more

Improving Performance And Power With HBM3
By Andy Patrizio - 30 Jan, 2023 - Comments: 0

HBM3 swings open the door to significantly faster data movement between memory and processors, reducing the power it takes to send and receive signals and boosting the performance of systems where high data throughput is required. But using this memory is expensive and complicated, and that likely will continue to be the case in the short term. High Bandwidth Memory 3 (HBM3) is the most rece... » read more

IC Stresses Affect Reliability At Advanced Nodes
By Ann Mutschler - 08 Dec, 2022 - Comments: 1

Thermal-induced stress is now one of the leading causes of transistor failures, and it is becoming a top focus for chipmakers as more and different kinds of chips and materials are packaged together for safety- and mission-critical applications. The causes of stress are numerous. In heterogeneous packages, it can stem from multiple components composed of different materials. “These materia... » read more

A Power-First Approach
By Brian Bailey - 27 Oct, 2022 - Comments: 7

It is becoming evidently clear that heat will be the limiter for the future of semiconductors. Already, large percentages of a chip are dark at any time, because if everything operated at the same time the amount of heat generated would exceed the ability of the chip and package to dissipate that energy. If we now start to contemplate stacking dies, where the ability to extract heat remains con... » read more

Research Bits: Sept. 20
By Jesse Allen - 20 Sep, 2022 - Comments: 0

Multi-mode memristors Researchers from ETH Zurich, the University of Zurich, and Empa built a new memristor that can operate in multiple modes and could potentially be used to mimic neurons in more applications. “There are different operation modes for memristors, and it is advantageous to be able to use all these modes depending on an artificial neural network’s architecture,” said R... » read more

Thermal Simulation Of DSMBGA And Coupled Thermal-Mechanical Simulation Of Large Body HDFO
By Nathan Whitchurch - 15 Sep, 2022 - Comments: 0

Electronic packaging has continued to become more complex with higher device count, higher power densities and Heterogeneous Integration (HI) becoming more common. In the mobile space, systems that were once separate components on a printed circuit board (PCB) have now been relocated along with all their associated passive devices and interconnects into single System in Package (SiP) style suba... » read more

Thermal Cycling Failure In Electronics
By Kelly Morgan - 19 Jul, 2022 - Comments: 0

Each time a device is turned off and on, its temperature changes. (Just think about how often your phone lights up all day.) Energy flowing through several layers of tightly stacked materials causes devices to heat up, then rapidly cool down. This repeated oscillation between temperatures over the lifetime of a device is called thermal cycling. Why thermal management is important Thermal cycl... » read more

Thermally Optimizing A High-Power PCB
By Cadence - 18 Jul, 2022 - Comments: 0

The growth of battery-powered applications is presenting new challenges for designers of electronic motor-driven solutions. Targeting higher performance and efficiency, the power stages of these products must manage high currents while meeting strict power dissipation and size requirements. This white paper illustrates a thermally aware workflow with the Cadence® Celsius™ Thermal Solver... » read more

Overcoming Signal, Power, And Thermal Challenges Implementing GDDR6 Interfaces
By Cadence - 22 Jun, 2022 - Comments: 0

Graphics processing units (GPUs) and graphics double data rate (GDDR) memory interfaces are essential to graphics cards, game consoles, high-performance computing (HPC), and machine learning applications. These interfaces enable data transfer speeds of over 665GB per second today and will continue to support well over a terabyte per second (TBps) in next-generation GDDR interfaces. Signal integ... » read more

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