Manufacturing Bits: Jan. 12

By Mark LaPedus - 12 Jan, 2016 - Comments: 0

World’s smallest magnet The University of Tokyo has developed what researchers claim is the world's smallest nano-magnet. The nano-size ferrite magnet consists of iron oxide. With the material, researches devised a 7.5nm structure with magnetic properties. [caption id="attachment_24751" align="alignleft" width="300"] Charting the world's smallest magnet (Source: Shin-ichi Ohkoshi)[/ca... » read more

Manufacturing Bits: Nov. 10

By Mark LaPedus - 10 Nov, 2015 - Comments: 1

Etching superconducting materials Superconductors are devices that have zero electrical resistance, making them attractive for a range of applications. But superconductors must be cooled down to temperatures at or near absolute zero on the Kelvin scale to work. This, in turn, limits their applications. Absolute zero equates to −273.15° on the Celsius scale and −459.67° on the Fahrenheit ... » read more

System Bits: Oct. 21

By Ann Mutschler - 21 Oct, 2014 - Comments: 0

Simplified superconducting circuits Computer chips with superconducting circuits, which means they have no electrical resistance, are said to be 50 to 100 times as energy-efficient as today’s technology. Superconducting chips are also said to have greater processing power: Superconducting circuits that use so-called Josephson junctions have been clocked at 770 gigahertz, or 500 times the spe... » read more

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Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: Tohoku University

Manufacturing Bits: Jan. 12

Manufacturing Bits: Nov. 10

System Bits: Oct. 21