Making microvias in packages
At the recent IEEE Electronic Components and Technology Conference (ECTC) in Las Vegas, Georgia Institute of Technology, Tokyo Ohka Kogyo (TOK) and Panasonic presented a paper on a technology that enables ultra-small microvias for advanced IC packages.
Researchers demonstrated a picosecond UV laser technology as well as materials, which enabled 2μm to 7μm vias...
» read more