tag: TSMC

2D Semiconductors Make Progress, But Slowly
By Katherine Derbyshire - 28 Feb, 2022 - Comments: 2

Researchers are looking at a variety of new materials at future nodes, but progress remains slow. In recent years, 2D semiconductors have emerged as a leading potential solution to the problem of channel control in highly scaled transistors. As devices shrink, the channel thickness should shrink proportionally. Otherwise, the gate capacitance won’t be large enough to control the flow of cu... » read more

Data Center Architectures In Flux
By Ann Mutschler - 24 Feb, 2022 - Comments: 0

Data center architectures are becoming increasingly customized and heterogeneous, shifting from processors made by a single vendor to a mix of processors and accelerators made by multiple vendors — including system companies' own design teams. Hyperscaler data centers have been migrating toward increasingly heterogeneous architectures for the past half decade or so, spurred by the rising c... » read more

Transistors Reach Tipping Point At 3nm
By Mark LaPedus - 23 Feb, 2022 - Comments: 1

The semiconductor industry is making its first major change in a new transistor type in more than a decade, moving toward a next-generation structure called gate-all-around (GAA) FETs. Although GAA transistors have yet to ship, many industry experts are wondering how long this technology will deliver — and what new architecture will take over from there. Barring major delays, today’s GAA... » read more

2022 Chip Forecast: Mixed Signals
By Mark LaPedus - 22 Feb, 2022 - Comments: 0

Jim Feldhan, president of Semico Research, sat down with Semiconductor Engineering to talk about the outlook for the semiconductor market. SE: What was your final 2021 semiconductor forecast? What is your 2022 semiconductor forecast? Feldhan: For 2021, world semiconductor revenues totaled $558 billion and units totaled over 1.1 trillion units. In terms of growth rate, revenues increased 2... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 18 Feb, 2022 - Comments: 0

Chipmakers Intel has announced a definitive agreement to acquire Tower, a specialty foundry vendor, for approximately $5.4 billion. With the acquisition of Tower, Intel expands its efforts in the foundry business, and put its rivals on notice. With Tower, Intel gains access to mature processes as well as specialty technologies, such as analog, CMOS image sensor, MEMS, power management and RF. ... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 11 Feb, 2022 - Comments: 0

Fab tools Lam Research has rolled out a new suite of selective etch products for use in developing next-generation technologies, such as gate-all-around (GAA) transistors. In the fab, selective etch helps chipmakers with complex structures. These etch tools provide selective and precision etching without modifying or causing damage to other critical material layers. Composed of three new... » read more

Manufacturing Bits: Feb. 1
By Mark LaPedus - 01 Feb, 2022 - Comments: 0

Fab equipment cybersecurity In a major step to help provide security in the semiconductor manufacturing supply chain, SEMI has published the first cybersecurity specifications and standards for fab equipment. For some time, the semiconductor industry has been developing new cybersecurity standards for fab equipment in an effort to protect systems from potential cyberattacks, viruses, and IP... » read more

Next-Gen 3D Chip/Packaging Race Begins
By Mark LaPedus - 31 Jan, 2022 - Comments: 5

The first wave of chips is hitting the market using a technology called hybrid bonding, setting the stage for a new and competitive era of 3D-based chip products and advanced packages. AMD is the first vendor to unveil chips using copper hybrid bonding, an advanced die-stacking technology that enables next-generation 3D-like devices and packages. Hybrid bonding stacks and connects chips usin... » read more

Photomask Challenges At 3nm And Beyond
By Mark LaPedus - 25 Jan, 2022 - Comments: 1

Experts at the Table: Semiconductor Engineering sat down to discuss optical and EUV photomasks issues, as well as the challenges facing the mask business, with Naoya Hayashi, research fellow at DNP; Peter Buck, director of MPC & mask defect management at Siemens Digital Industries Software; Bryan Kasprowicz, senior director of technical strategy at Hoya; and Aki Fujimura, CEO of D2S. What f... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 21 Jan, 2022 - Comments: 0

Fabs Intel has announced plans for an initial investment of more than $20 billion in the construction of two new leading-edge fabs in Ohio. Planning for the first two factories will start immediately, with construction expected to begin late in 2022. Production is expected to come online in 2025. As part of the announcement, Air Products, Applied Materials, Lam Research and Ultra Clean Technol... » read more

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