tag: TSMC

Fab Spending Hits New High
By Christian Dieseldorff - 07 Jun, 2017 - Comments: 0

The latest update to the World Fab Forecast report, published on May 31, 2017 by SEMI, reveals record spending for fab construction and fab equipment. Korea, Taiwan, and China all see large investments, and spending in Europe has also increased significantly. In 2017, over US$49 billion will be spent on equipment alone, a historic record for the semiconductor industry. Spending on new fab cons... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 02 Jun, 2017 - Comments: 0

Market research IC Insights has released its capital spending forecast by company. In total, there are 15 companies that are forecast to have semiconductor capital expenditures of $1.0 billion or more in 2017, up from 11 in 2016, according to IC Insights. Four companies—Intel, Samsung, GlobalFoundries, and SK Hynix—are expected to represent the bulk of the increase in spending, accord... » read more

Foundry Wars, Take Two
By Ed Sperling - 25 May, 2017 - Comments: 0

Samsung, GlobalFoundries, TSMC and Intel all have declared their intention to fill in nearly every node possible with multiple processes, different packaging options, and new materials. In fact, the only number that hasn't been taken so far is 9nm. It's not that one foundry's 10nm is the same as another's. Each company defines its nodes differently, and these days comparing nodes is almost m... » read more

Samsung Unveils Scaling, Packaging Roadmaps
By Ed Sperling - 24 May, 2017 - Comments: 5

Samsung Foundry unveiled an aggressive roadmap that scales down to 4nm, and which includes a fan-out wafer-level packaging technology that bridges chips in the redistribution layer, 18nm FD-SOI, and a new organizational structure that allows the unit much greater autonomy as a commercial enterprise. The moves put [getentity id="22865" e_name="Samsung Foundry"] in direct competition with [get... » read more

Reworking Established Nodes
By Ed Sperling - 24 May, 2017 - Comments: 2

New technology markets and a flattening in smartphone growth has sparked a resurgence in older technology processes. For many of these up-and-coming applications, there is no compelling reason to migrate to the latest process node, and equipment companies and fabs are rushing to fill the void. As with all electronic devices, the focus is on cost-cutting. But because these markets are likely ... » read more

The Race To 10/7nm
By Mark LaPedus - 22 May, 2017 - Comments: 4

Amid the ongoing ramp of 16/14nm processes in the market, the industry is now gearing up for the next nodes. In fact, GlobalFoundries, Intel, Samsung and TSMC are racing each other to ship 10nm and/or 7nm technologies. The current iterations of 10nm and 7nm technologies are scaled versions of today’s 16nm/14nm finFETs with traditional copper interconnects, high-k/metal-gate and low-k diele... » read more

High-Stakes Litho Game
By Ed Sperling - 18 May, 2017 - Comments: 0

The commercial introduction of EUV looks all but assured these days. There is enough history to show it works. Uptime and throughput are improving, and systems are shipping today. The question now is how to measure its success. In the short-term, this is a fairly simple financial exercise for companies like ASML and Zeiss, which have been closely collaborating to get these massive systems ou... » read more

Notes From The Chip Beat
By Mark LaPedus - 18 May, 2017 - Comments: 0

Over the last several months, I’ve attended a number of conferences, such as IEDM, SPIE, the FD-SOI Summit and others. At each conference, there is a dizzying amount of information and data. Eventually, some information turns into an article, while most ends up buried in a reporter’s notebook. In any case, here are five observations I’ve made, based on those and other events in the pa... » read more

Manufacturing Bits: May 16
By Mark LaPedus - 16 May, 2017 - Comments: 0

Musical learning chips Imec has demonstrated a neuromorphic chip. The brain-inspired chip, based on OxRAM technology, has the capability of self-learning and has been demonstrated to have the ability to compose music. Imec has combined state-of-the-art hardware and software to design chips that feature these characteristics of a self-learning system. Imec’s goal is to design the process t... » read more

Wirebond Technology Rolls On
By Mark LaPedus - 08 May, 2017 - Comments: 2

Several years ago, many predicted the demise of an older interconnect packaging technology called wire bonding, prompting the need for more advanced packaging types. Those predictions were wrong. The semiconductor industry today uses several advanced packaging types, but wire bonding has been reinvented over the years and remains the workhorse in packaging. For example, Advanced Semiconducto... » read more

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