Chip Industry Week In Review


Geopolitics U.S. lawmakers are urging tighter export controls on advanced semiconductor manufacturing equipment (SME) to China, warning existing loopholes threaten national security. "China is working to build domestic SME by exploiting access to U.S. and allied subcomponents required to produce tools," states the letter, which also says better coordination with allies is essential. The U.S.... » read more

Chip Industry Week In Review


Big deals and fundings Teradyne and MultiLane are forming a joint venture, MultiLane Test Products (MLTP), to accelerate the development of test solutions for high speed data connections.  Teradyne will be the majority owner. Ricursive Intelligence raised $300M Series A for AI-driven IC design. IonQ plans to acquire SkyWater for ~$1.8B, creating a "vertically integrated full-stack q... » read more

Chip Industry Technical Paper Roundup: Dec. 2


New technical papers recently added to Semiconductor Engineering’s library: [table id=497 /] Find more semiconductor research papers here. » read more

Comprehensive Performance Bound and Bottleneck Analysis Of Neuromorphic Accelerators (Harvard, Politecnico di Torino, Intel et al.)


A new technical paper titled "Modeling and Optimizing Performance Bottlenecks for Neuromorphic Accelerators" was published by researchers at Harvard University, Politecnico di Torino, Intel, LMU Munich, Accenture Labs, BootLoop AI, TU Delft and Wordly. Abstract "Neuromorphic accelerators offer promising platforms for machine learning (ML) inference by leveraging event-driven, spatially-expa... » read more

Chip Industry Week in Review


AI featured big at this week's Design Automation Conference (DAC) in San Francisco. Dozens of companies featured AI-related tools (see product section below), as well as significant improvements to existing tools and some entirely new approaches for designing chips. Among the highlights: Siemens unveiled an AI-enhanced toolset for the EDA design flow that enables customers to integrate the... » read more

Chip Industry Technical Paper Roundup: June 17


New technical papers recently added to Semiconductor Engineering’s library: [table id=440 /] Find more semiconductor research papers here.   » read more

The Impact Of Parameter Uncertainties On The Lifetime Prediction of Power Devices (TU Delft)


A new technical paper titled "Impact of Parameter Uncertainties on Power Electronic Device Lifetime Predictions" was published by researchers at TU Delft. Abstract "Properly addressing uncertainties in reliability analysis is essential for realistic lifetime predictions of power devices. This paper investigates parameter uncertainties on the lifetime estimation of power devices using an emp... » read more

Chip Industry Week in Review


The U.S. Commerce Department is tightening controls on EDA software sold to China by imposing additional license requirements. EDA companies are assessing the impact. Details on how broad the restrictions will be are still pending. The U.S. Federal Trade Commission (FTC) will require Synopsys and Ansys to divest key software assets — including optical, photonic, and RTL power analysis tool... » read more

Med Tech Morphs Into Consumer Wearables


Doctors have been using advanced technology for years, but the growing trend is for consumers to use devices at home and have direct access to their data. Watches and rings that were once primarily used for counting steps or registering sleep patterns can now read blood pressure, heart rate, blood oxygen, body temperature, and other early signs of illness. Meanwhile, various patches are under d... » read more

Chip Industry Week In Review


Analog Devices acquired Flex Logix's technology assets, along with its technical team. Semiconductor global sales increased 23% in Q3 2024 $166B, up almost 11% versus the same period in 2023, according to SIA. Notable regional year-to-year sales in September: Americas up 46%, China up 23%, Europe down 8%. Fig.1: Worldwide Semiconductor Revenues, year-to-year % change. Source: Semiconduc... » read more

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