tag: TU Wien

Chip Industry Week In Review
By The SE Staff - 28 Feb, 2025 - Comments: 0

Intel said its new fab in Licking County, Ohio will be delayed due to financial struggles and a need to align chip production with market demand, reported the Columbus Dispatch. Construction is now estimated to be completed in 2030, with operations to start in 2030 or 2031. The company said it already has invested $3.7 billion locally. Apple plans to invest more than $500 billion in the U.S... » read more

Research Bits: Feb. 18
By Jesse Allen - 18 Feb, 2025 - Comments: 0

Predicting band gap with neural networks Researchers from Kyoto University developed a machine learning model to predict the band gap of novel semiconductor materials. Using data from almost 2,000 semiconductor materials, the team tested six different neural networks. They found that the incorporation of conditional generative adversarial networks (CGAN) and message passing neural networks ... » read more

Chip Industry Technical Paper Roundup: Feb. 18
By Linda Christensen - 18 Feb, 2025 - Comments: 0

New technical papers recently added to Semiconductor Engineering’s library: [table id=406 /] Find all technical papers here. » read more

Simulation Study Of Vertically Stacked 2D NSFETs
By Technical Paper Link - 12 Feb, 2025 - Comments: 0

A new technical paper titled "Simulation of Vertically Stacked 2-D Nanosheet FETs" was published by researchers at Università di Pisa and TU Wien. Abstract "We present a simulation study of vertically stacked 2-D nanosheet field-effect transistors (NSFETs). The aim of this investigation is to assess the performance and potential of FinFET alternatives, i.e., gate-all-around (GAA) nanosheet... » read more

Chip Industry Week In Review
By The SE Staff - 24 Jan, 2025 - Comments: 0

The new Trump administration was quick to put a different stamp on the tech world: President Trump rescinded a long list of Biden’s executive orders, including those aimed at AI safety and the mandate for 50% EVs by 2030. Roughly 1.3 million EVs were sold in the U.S. in 2024, up 7.3% from 2023. The new administration announced $500 billion ($100 billion initially) in private sector in... » read more

Schottky Barrier Transistors: Status, Challenges and Modeling Tools
By Technical Paper Link - 08 Jan, 2025 - Comments: 0

A technical paper titled "Roadmap for Schottky barrier transistors" was published by researchers at University of Surrey, Namlab gGmbH, Forschungszentrum Jülich (FZJ), et al. Abstract "In this roadmap we consider the status and challenges of technologies that use the properties of a rectifying metal-semiconductor interface, known as a Schottky barrier (SB), as an asset for device functio... » read more

Chip Industry Technical Paper Roundup: Nov. 25
By Linda Christensen - 25 Nov, 2024 - Comments: 0

New technical papers recently added to Semiconductor Engineering’s library: [table id=386 /] » read more

Ge-Based Multigate SBFETs Operated In An NDR Mode (TU Wien, JKU)
By Technical Paper Link - 15 Nov, 2024 - Comments: 0

A new technical paper titled "Implementation of Negative Differential Resistance-Based Circuits in Multigate Ge Transistors" was published by researchers at TU Wien and JKU (Johannes Kepler University). Abstract: "The co-integration of negative differential resistance (NDR) and Si-based CMOS technology might be a promising concept for multimode devices and circuits with enhanced performance... » read more

Research Bits: Oct. 8
By Liz Allan - 08 Oct, 2024 - Comments: 0

Soft, flexible polymer semiconductors Stanford University materials scientists used a specialized electron microscope – cryo-electron microscopy (Cryo 4D-STEM) – to explore the microstructure of soft semiconductors that could lead to new-generation electronics. Organic mixed ionic-electronic conductors (OMIECs) are soft, flexible polymer semiconductors with promising electrochemical qua... » read more

Chip Industry Week In Review
By The SE Staff - 19 Jul, 2024 - Comments: 0

The University of Texas at Austin’s Texas Institute for Electronics (TIE) was awarded $840 million to establish a Department of Defense microelectronics manufacturing center. This center will focus on developing advanced semiconductor microsystems to enhance U.S. defense systems. The project is part of DARPA's NGMM Program. The U.S. Dept. of Commerce announced preliminary terms with Global... » read more

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