tag: TU Wien

Week In Review: Design, Low Power
By Susan Rambo - 31 Mar, 2023 - Comments: 0

Synopsys rolled out an AI-driven design suite called Synopsys.ai at the Synopsys User Group conference this week, which it says reduces time to better results at multiple points in the design flow. The company noted the new technology uses reinforcement learning, which compensates for relatively small data sets by allowing engineers to interact with that data more easily at any point, and to ch... » read more

Research Bits: March 28
By Susan Rambo - 28 Mar, 2023 - Comments: 0

Modeling how the nose smells The first 3D molecular-level picture of how an odor molecule binds to and activates an odorant receptor (OR) on olfactory cells in the nose may help us understanding and eventually be used to build a map of all the receptors. Scientists at UC San Francisco (UCSF) used cryo-electron microscopy (cryo-EM), which UCSF developed, to take a moving picture of the wiggly r... » read more

Chip Industry’s Technical Paper Roundup: Mar. 14
By Linda Christensen - 14 Mar, 2023 - Comments: 0

New technical papers recently added to Semiconductor Engineering’s library: [table id=86 /] If you have research papers you are trying to promote, we will review them to see if they are a good fit for our global audience. At a minimum, papers need to be well researched and documented, relevant to the semiconductor ecosystem, and free of marketing bias. There is no cost involved for us ... » read more

FPGAs: Automated Framework For Architecture-Space Exploration of Approximate Accelerators
By Technical Paper Link - 10 Mar, 2023 - Comments: 0

A technical paper titled "autoXFPGAs: An End-to-End Automated Exploration Framework for Approximate Accelerators in FPGA-Based Systems" was published (preprint) by researchers at TU Wien, Brno University of Technology, and NYUAD. Abstract "Generation and exploration of approximate circuits and accelerators has been a prominent research domain exploring energy-efficiency and/or performance... » read more

Looking Forward To SPIE, And Beyond
By Katherine Derbyshire - 16 Feb, 2023 - Comments: 0

On the eve of this year’s SPIE Advanced Lithography + Patterning conference, I took a look at the IEEE Devices and Systems Roadmap’s lithography section. It’s especially notable for the emergence of EUV lithography, which has quickly become critical for advanced logic. High-NA tools to support still smaller dimensions are on the horizon. In the near-term, though, the key challenge is not ... » read more

Chip Industry’s Technical Paper Roundup: Nov. 15
By Linda Christensen - 15 Nov, 2022 - Comments: 0

New technical papers added to Semiconductor Engineering’s library this week. [table id=63 /] » read more

Using More Germanium In Chips for Energy Efficiency & Achievable Clock Frequencies
By Technical Paper Link - 08 Nov, 2022 - Comments: 0

A new technical paper titled "Composition Dependent Electrical Transport in Si1−xGex Nanosheets with Monolithic Single-Elementary Al Contacts" was published by researchers at TU Wien (Vienna University of Technology), Johannes Kepler University, CEA-LETI, and Swiss Federal Laboratories for Materials Science and Technology. Find the technical paper here. Published September 2022. Abstrac... » read more

Technical Paper Round-Up: June 8
By Linda Christensen - 08 Jun, 2022 - Comments: 0

  New technical papers added to Semiconductor Engineering’s library this week. [table id=32 /] Semiconductor Engineering is in the process of building this library of research papers. Please send suggestions (via comments section below) for what else you’d like us to incorporate. If you have research papers you are trying to promote, we will review them to see if they are a ... » read more

Fermi-level Tuning Improves Device Stability of 2D Transistors With Amorphous Gate Oxides
By Technical Paper Link - 06 Jun, 2022 - Comments: 0

New technical paper titled "Improving stability in two-dimensional transistors with amorphous gate oxides by Fermi-level tuning" from researchers at Institute for Microelectronics, TU Wien, AMO GmbH, University of Wuppertal, and RWTH Aachen University. Abstract "Electronic devices based on two-dimensional semiconductors suffer from limited electrical stability because charge carriers origin... » read more

Hybrid Sensing Platform w/Silicon Nanowires on a Fully Functional CMOS Chip Containing the Readout Electronics & Signal amplification
By Technical Paper Link - 03 Jun, 2022 - Comments: 0

New technical paper titled "Multisite Dopamine Sensing With Femtomolar Resolution Using a CMOS Enabled Aptasensor Chip" from TU Dresden, Riken Quantitative Biological Center, Imperial College London, NaMLab gGmbH, ETH Zürich, MaxWell Biosystems AG, TU Wien, and Institute of Radiopharmaceutical Cancer Research. Abstract "Many biomarkers including neurotransmitters are found in external bo... » read more

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