tag: UCIe

Why Using Commercial Chiplets Is So Difficult
By Ed Sperling - 18 Oct, 2023 - Comments: 0

Experts at the Table: Semiconductor Engineering sat down to discuss use cases and challenges for commercial chiplets with Saif Alam, vice president of engineering at Movellus; Tony Mastroianni, advanced packaging solutions director at Siemens Digital Industries Software; Mark Kuemerle, vice president of technology at Marvell; and Craig Bishop, CTO at Deca Technologies. What follows are excerpts... » read more

Who Will Regulate Data Exchanges In Chiplets?
By Ed Sperling - 17 Aug, 2023 - Comments: 0

Scaling is still important when it comes to logic and low power, but it's no longer the main avenue for improving performance. What used to be a single chip, comprised of various IP blocks and components on a single SoC, is giving way to a heterogeneous collection of chiplets — at least for the big chipmakers and system companies at the leading edge. Chiplets are currently the best solutio... » read more

Enabling A Chiplet Supply Chain
By Vik Chaudhry - 17 Aug, 2023 - Comments: 0

Chiplets have been in the news quite a bit lately. A chiplet-based architecture offers several advantages that chip designers can benefit from as they bring out new products to the market. Over the years, system designers have integrated more and more functions into a system on chip (SoC). As a result, the size of SoCs keeps increasing. Even though SoCs provide several advantages in performance... » read more

Chiplets: Deep Dive Into Designing, Manufacturing, And Testing
By The SE Staff - 07 Aug, 2023 - Comments: 0

Chiplets are a disruptive technology. They change the way chips are designed, manufactured, tested, packaged, as well as the underlying business relationships and fundamentals. But they also open the door to vast new opportunities for existing chipmakers and startups to create highly customized components and systems for specific use cases and market segments. This LEGO-like approach sounds ... » read more

HBM’s Future: Necessary But Expensive
By Karen Heyman - 20 Jul, 2023 - Comments: 0

High-bandwidth memory (HBM) is becoming the memory of choice for hyperscalers, but there are still questions about its ultimate fate in the mainstream marketplace. While it’s well-established in data centers, with usage growing due to the demands of AI/ML, wider adoption is inhibited by drawbacks inherent in its basic design. On the one hand, HBM offers a compact 2.5D form factor that enables... » read more

Megatrends At DAC
By Ann Mutschler - 17 Jul, 2023 - Comments: 0

Spotting key trends over three days of a semiconductor design conference is a challenge, but some important ones come into focus after attending multiple sessions — AI/ML, chiplet integration, and heterogeneous integration in an SoC and package. Frank Schirrmeister, vice president solutions and business development at Arteris IP, talks about a variety of topics that fit under the DAC umbrella... » read more

Why Auto Ecosystem Relationships Are Changing
By Ann Mutschler - 19 Jun, 2023 - Comments: 0

The automotive industry is in the midst of rapid change on many fronts. OEMs are exploring new functions and features to add to their vehicles, including chiplets, electrification, autonomous features, as well as new vehicle architectures that will determine how vehicles are going to be designed from the foundation up. But all of this is dependent on the relationships between all of the ecosyst... » read more

Software-Defined Hardware Architectures
By Brian Bailey - 31 May, 2023 - Comments: 0

Hardware/software co-design has been a goal for several decades, but success has been limited. More recently, progress has been made in optimizing a processor as well as the addition of accelerators for a given software workload. While those two techniques can produce incredible gains, it is not enough. With increasing demands being placed on all types of processing, single-processor solutio... » read more

Chiplet Planning Kicks Into High Gear
By Ann Mutschler - 25 May, 2023 - Comments: 0

Chiplets are beginning to impact chip design, even though they are not yet mainstream and no commercial marketplace exists for this kind of hardened IP. There are ongoing discussions about silicon lifecycle management, the best way to characterize and connect these devices, and how to deal with such issues as uneven aging and thermal mismatch. In addition, a big effort is underway to improve... » read more

Automotive Relationships Shifting With Chiplets
By Ann Mutschler - 24 May, 2023 - Comments: 0

The automotive industry is in the midst of a tremendous and rapid change on many fronts. OEMs are exploring new functions and features to add to their vehicles, including chiplets, electrification, autonomous features, as well as new vehicle architectures that will determine how vehicles are going to be designed from the foundation up. All of this is dependent on the relationships between all o... » read more

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