tag: UCLA

Designing a 2048-Chiplet, 14336-Core Waferscale Processor
By Technical Paper Link - 14 Mar, 2022 - Comments: 0

Abstract "Waferscale processor systems can provide the large number of cores, and memory bandwidth required by today’s highly parallel workloads. One approach to building waferscale systems is to use a chiplet-based architecture where pre-tested chiplets are integrated on a passive silicon-interconnect wafer. This technology allows heterogeneous integration and can provide significant perfor... » read more

Power/Performance Bits: Jan. 3
By Jesse Allen - 03 Jan, 2022 - Comments: 0

Optical device integration Researchers from the University of Strathclyde, University of Glasgow, and the Australian National University propose a way to place multiple micron-scale optical devices made from different materials close together on a single silicon chip. “The development of electronics that are based on silicon transistors has enabled increasingly more powerful and flexible ... » read more

Materials and Device Simulations for Silicon Qubit Design and Optimization
By Technical Paper Link - 27 Oct, 2021 - Comments: 0

Abstract: "Silicon-based microelectronics technology is extremely mature, yet this profoundly important material is now also poised to become a foundation for quantum information processing technologies. In this article, we review the properties of silicon that have made it the material of choice for semiconductor-based qubits with an emphasis on the role that modeling and simulation have play... » read more

Progress On General-Purpose Quantum Computers
By Katherine Derbyshire - 21 Oct, 2021 - Comments: 0

The race is on to scale up quantum computing, transforming it from an esoteric research tool into a commercially viable, general-purpose machine. Special-purpose quantum computers have been available for several years now. Systems like D-Wave’s Advantage focus on specific classes of problems that are amenable to modeling as quantum systems. Still, the ultimate goal of having a general purp... » read more

Power/Performance Bits: Oct. 11
By Jesse Allen - 11 Oct, 2021 - Comments: 0

Finer printed circuits Researchers from the National Institute for Materials Science in Japan, Jiangnan University, Zhengzhou University, Senju Metal Industry Co., and C-INK Co. developed a way to print smaller features for printed electronics. The directed self-assembly method increases the chemical polarity of predetermined areas on a surface, which promoted selective adhesion of metallic na... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 17 Sep, 2021 - Comments: 0

Packaging and test Advantest and PDF Solutions have launched their first jointly developed offering since forming a partnership in 2020. The new product is called the Advantest Cloud Solutions Dynamic Parametric Test (ACS DPT) solution. It integrates PDF Solutions’ Exensio portfolio of data analytics with Advantest’s V93000 Parametric Test System. The ACS DPT solution is designed to op... » read more

Power/Performance Bits: Sept. 14
By Jesse Allen - 14 Sep, 2021 - Comments: 0

Thermal management material Engineers at the University of California Los Angeles integrated a new thermal management material, boron arsenide, with a HEMT chip to demonstrate the material's potential. The team developed boron arsenide as a thermal management material in 2018 and found it to be very effective at drawing and dissipating heat. In the latest experiments, they used wide band... » read more

Manufacturing Bits: April 27
By Mark LaPedus - 27 Apr, 2021 - Comments: 0

Next-gen neuromorphic computing The European Union (EU) has launched a new project to develop next-generation devices for neuromorphic computing systems. The project, called MeM-Scales, plans to develop a novel class of algorithms, devices, and circuits that reproduce multi-timescale processing of biological neural systems. The results will be used to build neuromorphic computing systems th... » read more

Power/Performance Bits: March 16
By Jesse Allen - 16 Mar, 2021 - Comments: 0

Adaptable neural nets Neural networks go through two phases: training, when weights are set based on a dataset, and inference, when new information is assessed based on those weights. But researchers at MIT, Institute of Science and Technology Austria, and Vienna University of Technology propose a new type of neural network that can learn during inference and adjust its underlying equations to... » read more

Power/Performance Bits: Jan. 19
By Jesse Allen - 19 Jan, 2021 - Comments: 0

Electronic skin for health tracking Researchers at the University of Colorado Boulder developed a stretchy electronic 'skin' that can perform the tasks of wearable fitness devices such as tracking body temperature, heart rate, and movement patterns. "Smart watches are functionally nice, but they're always a big chunk of metal on a band," said Wei Zhang, a professor in the Department of Chem... » read more

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