Week In Review: Design, Low Power

By Jesse Allen - 27 Jul, 2018 - Comments: 0

Tools & IP Cadence uncorked the latest version of the Sigrity signal integrity analysis family of tools, adding a 3D design and 3D analysis environment integrated with Allegro PCB tools that allows users to import mechanical structures, such as cables and connectors, and merge them with the PCB for modeling and optimization as one structure. It also adds full Rigid-Flex PCB extraction from... » read more

Debug Issues Grow At New Nodes

By Ann Mutschler - 26 Jul, 2018 - Comments: 0

Debugging and testing chips is becoming more time-consuming, more complicated, and significantly more difficult at advanced nodes as well as in advanced packages. The main problem is that there are so many puzzle pieces, and so many different use cases and demands on those pieces, that it's difficult to keep track of all the changes and potential interactions. Some blocks are "on" sometimes,... » read more

When Bugs Escape

By Brian Bailey - 26 Jul, 2018 - Comments: 0

Bugs are a fact of life, and they always have been. But verification methodologies may not have evolved fast enough to keep up with the growing size and complexity of systems. The types of bugs are changing, too. Some people call these corner cases. Others call them outliers. Still another group refers to them as simulation-resistance superbugs. In markets such as automotive, the notion o... » read more

Safety, Security And PPA Tradeoffs

By Brian Bailey - 23 Jul, 2018 - Comments: 0

Safety and security are emerging as key design tradeoffs as chips are added into safety-critical markets, adding even more complexity into an already complicated optimization process. In the early days of semiconductor design, performance and area were traded off against each other. Then power became important, and the main tradeoffs became power, performance and area (PPA). But as chips inc... » read more

Blog Review: July 11

By Jesse Allen - 11 Jul, 2018 - Comments: 0

Synopsys' Taylor Armerding warns that while significant router vulnerabilities have been known about for years, security mostly hasn't been getting better, leading to a 539% increase in attacks targeting routers since the fourth quarter of 2017. In a video, Mentor's Colin Walls walks through how to deal with the initialization of non-volatile RAM in embedded programming, including suggestion... » read more

Searching For A System Abstraction

By Brian Bailey - 28 Jun, 2018 - Comments: 3

Without abstraction, advances in semiconductor design would have stalled decades ago and circuits would remain about the same size as analog blocks. No new abstractions have emerged since the 1990s that have found widespread adoption. The slack was taken up by IP and reuse, but IP blocks are becoming larger and more complex. Verification by isolation is no longer a viable strategy at the system... » read more

The Week In Review: Design

By Jesse Allen - 22 Jun, 2018 - Comments: 0

Tools Synopsys revealed a power analysis solution for early SoC design as well as signoff-accurate power and reliability closure. PrimePower has reliability as a major focus, expanding power and reliability signoff and ECO closure capabilities from physical awareness to cell electromigration effects. Supported power types include peak power, average power, clock network power, leakage power, a... » read more

Blog Review: June 20

By Jesse Allen - 20 Jun, 2018 - Comments: 0

Mentor's Randy Allen digs into OpenACC, a collection of directives and routines to help a compiler uncover and schedule parallelism, plus an examination of the GCC implementation's performance. Cadence's Paul McLellan takes a look at the shifting opinions on FD-SOI vs. finFET as Dan Hutcheson of VLSI Research finds most see the two as complementary technologies in his latest survey. Synop... » read more

Blog Review: June 13

By Jesse Allen - 13 Jun, 2018 - Comments: 0

Synopsys' Taylor Armerding looks at what the flaws in OpenPGP and S/MIME encryption means for the IoT and warns that the problems of patching such devices could lead to an increasing chance of security failures. Cadence's Paul McLellan takes a peek at Imec's roadmap to see what the path to 3nm looks like, how nanosheets fit in, and why design and system technology co-optimization is necessar... » read more

FPGAs Becoming More SoC-Like

By Ann Mutschler - 04 Jun, 2018 - Comments: 1

FPGAs are blinged-out rockstars compared to their former selves. No longer just a collection of look-up tables (LUTs) and registers, FPGAs have moved well beyond into now being architectures for system exploration and vehicles for proving a design architecture for future ASICs. This family of devices now includes everything from basic programmable logic all the way up to complex SoC devices.... » read more

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Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

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