tag: UMC

Week In Review: Manufacturing, Test
By Mark LaPedus - 28 May, 2021 - Comments: 0

Government policy The U.S. government hopes to build more fabs and expand its R&D efforts in the United States. To help enable those efforts, U.S. Senate Majority Leader Charles Schumer has introduced the new bipartisan U.S. Innovation and Competition Act. This combines Schumer’s Endless Frontier Act and other bipartisan competitiveness bills. It includes $52 billion in emergency supplem... » read more

The Increasingly Uneven Race To 3nm/2nm
By Mark LaPedus and Ed Sperling - 24 May, 2021 - Comments: 2

Several chipmakers and fabless design houses are racing against each other to develop processes and chips at the next logic nodes in 3nm and 2nm, but putting these technologies into mass production is proving both expensive and difficult. It's also beginning to raise questions about just how quickly those new nodes will be needed and why. Migrating to the next nodes does boost performance an... » read more

Demand, Lead Times Soar For 300mm Equipment
By Mark LaPedus - 20 May, 2021 - Comments: 0

A surge in demand for various chips is causing select shortages and extended lead times for many types of 300mm semiconductor equipment, photomask tools, wafers, and other products. For the last several years, 200mm equipment has been in short supply in the market, but issues are now cropping up throughout the 300mm supply chain, as well. Traditionally, lead times have been three to six mont... » read more

Advanced Packaging’s Next Wave
By Mark LaPedus - 20 May, 2021 - Comments: 0

Packaging houses are readying the next wave of advanced packages, enabling new system-level chip designs for a range of applications. These advanced packages involve a range of technologies, such as 2.5D/3D, chiplets, fan-out and system-in-package (SiP). Each of these, in turn, offers an array of options for assembling and integrating complex dies in an advanced package, providing chip custo... » read more

Automotive IC Shortage Drags On
By Patrick Waurzyniak - 20 May, 2021 - Comments: 1

The current automotive semiconductor shortages won’t end anytime soon. When the COVID-19 pandemic hit in early 2020, it wreaked havoc on the worldwide supply chain, but it especially caught automakers flat-footed. When the auto OEMs canceled chip orders during a roughly eight-week period of plant shutdowns, they later found their supplies of critical ICs had evaporated. To make it an ev... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 30 Apr, 2021 - Comments: 0

Chipmakers and OEMs Intel wants $9.7 billion in subsidies for use in building a leading-edge fab in Europe, according to a report from Reuters. As reported, in March, Intel re-entered the foundry business, positioning itself against Samsung and TSMC at the leading edge, and against a multitude of foundries working at older nodes. Eighteen members of the European Union recently launched an ... » read more

Foundry Wars Begin
By Mark LaPedus - 19 Apr, 2021 - Comments: 3

Leading-edge foundry vendors are gearing up for a new, high-stakes spending and technology race, setting the stage for a possible shakeup across the semiconductor manufacturing landscape. In March, Intel re-entered the foundry business, positioning itself against Samsung and TSMC at the leading edge, and against a multitude of foundries working at older nodes. Intel announced plans to build ... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 02 Apr, 2021 - Comments: 0

Government policy President Biden has rolled out a proposal to boost the infrastructure in the U.S. As part of the plan, the president is calling on Congress to invest $50 billion in U.S. semiconductor manufacturing and research. The proposal must pass Congress, which isn’t going to be easy. “The President’s plan would invest ambitiously in U.S. semiconductor workers, manufacturing, and ... » read more

A Novel Complementary Architecture of One-time-programmable Memory and Its Applications as Physical Unclonable Function (PUF) and One-time Password
By Technical Paper Link - 31 Mar, 2021 - Comments: 0

Abstract "For the first time, we proposed a 2T complementary architecture of one-time-programmable memory (OTP) in a foundry logic CMOS chip. It was then used to realize the PUF (Physical unclonable function), and the combination with the AI technology to provide a one-time password capability. At first, an OTP was developed based on a novel 2T CMOS unit cell. The experimental results show t... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 26 Mar, 2021 - Comments: 0

Chipmakers Intel has re-entered the foundry business after a failed attempt several years ago. In its new efforts, Intel is establishing a new standalone business unit called Intel Foundry Services. As part of those efforts, Intel has announced plans to build two new fabs in Arizona. This build-out represents an investment of approximately $20 billion. “INTC hosted a strategy update with ... » read more

← Older posts Newer posts →

  • Sponsors

About

Navigation

Connect With Us

Copyright ©2013-2024 SMG   |  Terms of Service  |  Privacy Policy