New Transistor Structures At 3nm/2nm


Several foundries continue to develop new processes based on next-generation gate-all-around transistors, including more advanced high-mobility versions, but bringing these technologies into production is going to be difficult and expensive. Intel, Samsung, TSMC and others are laying the groundwork for the transition from today’s finFET transistors to new gate-all-around field-effect trans... » read more

Week In Review: Manufacturing, Test


Chipmakers Intel posted its quarterly results. But the big question is whether the chip giant will outsource more of its production to the foundries. As reported, Intel has fallen behind TSMC and Samsung in process technology. And Intel may need to outsource some of its chip production to stay ahead. All of this rests on Pat Gelsinger, the new CEO at Intel. Gelsinger will be taking over for... » read more

Week In Review: Design, Low Power


Cadence will acquire NUMECA International, a provider of computational fluid dynamics (CFD), mesh generation, multi-physics simulation, and optimization solutions for industries including aerospace, automotive, industrial, and marine. “Next-generation products and systems require comprehensive multi-physics engineering solutions encompassing IP, semiconductors, IC packaging, modules, board... » read more

Week In Review: Manufacturing, Test


Chipmakers and OEMs Intel has appointed Pat Gelsinger as its new chief executive, effective Feb. 15. Gelsinger will also join Intel’s board upon assuming the role. He will succeed Bob Swan, who will remain CEO until Feb. 15. Most recently, Gelsinger served as the CEO of VMware since 2012. He also spent 30 years at Intel, becoming the company’s first chief technology officer. The move fo... » read more

Week In Review: Manufacturing, Test


Chipmakers SMIC’s shares fell following the resignation of the company co-CEO, according to a report from Bloomberg. Liang Mong Song, co-CEO of the Chinese foundry company, has proposed to resign and the company has become aware of Liang’s intention of conditional resignation, according to a filing. A former technologist at TSMC and Samsung, Liang has opposed the appointment of a new board... » read more

200mm Demand Surges


A surge in demand for various chips is causing shortages for select 200mm foundry capacity as well as 200mm fab equipment, and it shows no signs of abating in 2021. Foundry customers will face a shortfall of 200mm capacity at select foundries at least in the first half of 2021, and perhaps beyond. Those customers will need to plan ahead to ensure they obtain enough 200mm capacity in 2021. Ot... » read more

Week In Review: Manufacturing, Test


Government policy--semiconductors Eighteen members of the European Union have launched an initiative to boost the EU’s efforts in processors and semiconductor technologies. The member nations will also work together to bolster leading-edge manufacturing capacity. The EU plans to invest up to $145 billion in the effort. “Europe has all it takes to diversify and reduce critical dependenci... » read more

Week In Review: Manufacturing, Test


Market research VLSI Research has raised its forecast for semiconductors and fab equipment in 2020. In its previous forecast, VLSI Research projected that the equipment market would reach $84.8 billion in 2020, up 10.1% over 2019. Now, in its latest forecast (See page 2), the equipment market is projected to hit $89.8 billion in 2020, up 16.6%. “The equipment business is booming,” said ... » read more

Emerging Apps And Challenges For Packaging


Advanced packaging is playing a bigger role and becoming a more viable option to develop new system-level chip designs, but it also presents chipmakers with a confusing array of options and sometimes a hefty price tag. Automotive, servers, smartphones and other systems have embraced advanced packaging in one form or another. For other applications, it's overkill, and a simpler commodity pack... » read more

Week In Review: Manufacturing, Test


Fab tools PDF Solutions has entered into a definitive agreement to acquire Cimetrix. Under the terms, PDF will pay a cash amount of $35.0 million, net of cash on Cimetrix’s balance sheet as of closing, and subject to other closing adjustments. With the move, PDF will expand into new markets. Cimetrix is a provider of equipment connectivity products for smart manufacturing and Industry 4.0... » read more

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