Chip Industry Technical Paper Roundup: June 3


New technical papers recently added to Semiconductor Engineering’s library: [table id=436 /] Find more semiconductor research papers here. » read more

A Lightweight Scan Instrumentation For Enhancing The Post-Silicon Test Efficiency in ICs (U. of Florida)


A technical paper titled "Enhancing Test Efficiency through Automated ATPG-Aware Lightweight Scan Instrumentation" was published by researchers at University of Florida. Abstract "Scan-based Design-for-Testability (DFT) measures are prevalent in modern digital integrated circuits to achieve high test quality at low hardware cost. With the advent of 3D heterogeneous integration and chiplet-b... » read more

Chip Industry Technical Paper Roundup: Apr. 29


New technical papers recently added to Semiconductor Engineering’s library: [table id=424 /] Find more semiconductor research papers here. » read more

A Survey Of Digital Twins and Other Prototyping Technologies for Vehicles


A new technical paper titled "Digital Twin Technologies for Vehicular Prototyping: A Survey" was published by researchers at Central Michigan University and University of Florida. Abstract "Digital Twin (DT) technology is widely regarded as one of the most promising tools for industry development, demonstrating substantial application across numerous cyber-physical systems. Gradually, this ... » read more

Chip Industry Technical Paper Roundup: Apr. 22


New technical papers recently added to Semiconductor Engineering’s library: [table id=421 /] Find more semiconductor research papers here. » read more

Chip Industry Week In Review


Don't have time to read this? Check out Semiconductor Engineering's Inside Chips podcast.  The U.S. Department of Commerce is investigating TSMC for potential export control violations involving Huawei chips, reports Reuters. The probe follows TechInsights' teardown of a Huawei AI accelerator chip last year. The foundry, meanwhile, maintains it has not shipped any chips to Huawei since 2020... » read more

Countermeasure Against Confidentiality And Integrity Attacks On Hardware IP (U. of Florida)


A new technical paper titled "HIPR: Hardware IP Protection through Low-Overhead Fine-Grain Redaction" was published by researchers at University of Florida. Abstract "Hardware IP blocks have been subjected to various forms of confidentiality and integrity attacks in recent years due to the globalization of the semiconductor industry. System-on-chip (SoC) designers are now considering a zero... » read more

Chip Industry Technical Paper Roundup: Apr. 7


New technical papers recently added to Semiconductor Engineering’s library: [table id=419 /] Find more semiconductor research papers here. » read more

Chip Industry Week In Review


Check out our new Inside Chips podcast. President Trump’s ‘Liberation Day’ tariffs were announced this week. The executive order stated that semiconductors and copper imports are not directly subject to the reciprocal tariff, although the exemption may be short-lived. Semiconductor equipment and tools were not mentioned, leaving the industry searching for clarification. Regardless, hig... » read more

LLM-based Agentic Framework Automating HW Security Threat Modeling And Test Plan Generation (U. of Florida)


A new technical paper titled "ThreatLens: LLM-guided Threat Modeling and Test Plan Generation for Hardware Security Verification" was published by researchers at University of Florida. Abstract "Current hardware security verification processes predominantly rely on manual threat modeling and test plan generation, which are labor-intensive, error-prone, and struggle to scale with increasing ... » read more

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