tag: University of Florida

Systems-in-Package: Authenticated Partial Encryption Protocol For Secure Testing (U. of Florida)
By Technical Paper Link - 12 Nov, 2024 - Comments: 0

A new technical paper titled "GATE-SiP: Enabling Authenticated Encryption Testing in Systems-in-Package" was published by researchers at University of Florida and University of Central Florida. Abstract: "A heterogeneous integrated system in package (SIP) system integrates chiplets outsourced from different vendors into the same substrate for better performance. However, during post-integra... » read more

Chip Industry Technical Paper Roundup: Oct. 29
By Linda Christensen - 29 Oct, 2024 - Comments: 0

New technical papers recently added to Semiconductor Engineering’s library: [table id=375 /] More Reading Chip Industry Week In Review Intel’s EU court win; high-NA benchmarks and new maskless litho; SiC down, GaN up; Natcast’s plan; Xiaomi’s 3nm chip; semi tax credit rules; RISC-V; lithium mine; AI-edge expansion. Technical Paper Library home » read more

Overview Of Security Verification Methodologies for SoC Designs Pre-Silicon (U. of Florida)
By Technical Paper Link - 23 Oct, 2024 - Comments: 0

A technical paper titled "A Survey on SoC Security Verification Methods at the Pre-silicon Stage" was recently published by researchers at University of Florida. Abstract "This paper presents a survey of the state-of-the-art pre-silicon security verification techniques for System-on-Chip (SoC) designs, focusing on ensuring that designs, implemented in hardware description languages (HDLs) a... » read more

Chip Industry Technical Paper Roundup: Oct. 22
By Linda Christensen - 22 Oct, 2024 - Comments: 0

New technical papers recently added to Semiconductor Engineering’s library: [table id=371 /]   More Reading Chip Industry Week In Review AI CPU chiplet platform; Intel-AMD pact; GDDR7 DRAM; AI-RFIC funding; CHIPS Act awards; NoC tiling; thermal modeling on chiplets; $900M nuclear tech and more. Technical Paper Library home » read more

Chip Industry Week In Review
By The SE Staff - 18 Oct, 2024 - Comments: 0

Arm joined forces with Korea's Samsung Foundry, ADTechnology, and Rebellions to create a CPU chiplet platform for AI training and inference. The new chiplet will be based on Samsung's 2nm gate-all-around technology. Intel and AMD, arch competitors for decades, formed an x86 ecosystem advisory group to collaborate on architectural interoperability and simplify software development. Samsung... » read more

Physics-Based Efficient Device Model for Fe-TFTs (Univ. of Florida)
By Technical Paper Link - 17 Oct, 2024 - Comments: 0

A new technical paper titled "An efficient device model for ferroelectric thin-film transistors" was published by researchers at University of Florida. Abstract "Ferroelectric thin-film transistors (Fe-TFTs) have promising potential for flexible electronics, memory, and neuromorphic computing applications. Here, we report on a physics-based efficient device model for Fe-TFTs that effectivel... » read more

Securing Advanced Packaging Supply Chain With Inherent HW Identifiers Using Imaging Techniques
By Technical Paper Link - 14 Oct, 2024 - Comments: 0

A new technical paper titled "Fault-marking: defect-pattern leveraged inherent fingerprinting of advanced IC package with thermoreflectance imaging" was published by researchers at University of Florida and University of Cincinnati. "This work visits the existing challenges and limitations of traditional embedded fingerprinting and watermarking approaches, and proposes the notion of inherent... » read more

Chip Industry Week In Review
By The SE Staff - 11 Oct, 2024 - Comments: 0

Imec announced a new automotive chiplet consortium to evaluate which different architectures and packaging technologies are best for automotive applications. Initial members includes Arm, ASE, Cadence, Siemens, Synopsys, Bosch, BMW, Tenstorrent, Valeo, and SiliconAuto. Imec also launched star, a global network bringing together automotive and semiconductor innovators to address technological c... » read more

Devising Security Solutions For Hardware Threats
By Adam Kovac - 25 Sep, 2024 - Comments: 0

Experts At The Table: Hardware security has evolved considerably in recent years, but getting products to market is a challenge in an environment where threats are always evolving and rarely predictable. That’s especially true given the sheer volume and variety of products being introduced. Semiconductor Engineering sat down with a panel of experts at the Design Automation Conference in San F... » read more

Hardware Security Set To Grow Quickly
By Adam Kovac - 22 Aug, 2024 - Comments: 0

Experts At The Table: The hardware security ecosystem is young and relatively small but could see a major boom in the coming years. As companies begin to acknowledge how vulnerable their hardware is, industry standards are being set, but must leave room for engineers to experiment. As part of an effort to determine the best way forward, Semiconductor Engineering sat down with a panel of experts... » read more

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