tag: University of Florida

Chip Industry Week In Review
By The SE Staff - 07 Feb, 2025 - Comments: 0

The chip industry is well on its way to hit $1 trillion in revenue by the end of its decade. Several analyst firms released 2024 annual results and 2025 predictions: Worldwide semiconductor revenue reached $626 billion in 2024, an 18% increase versus 2023, according to preliminary Gartner report. Memory revenue grew about 70%  2024 versus 2023. The firm forecasts that HBM will make up 19%... » read more

Chip Industry Technical Paper Roundup: Feb. 4
By Linda Christensen - 04 Feb, 2025 - Comments: 0

New technical papers recently added to Semiconductor Engineering’s library: [table id=403 /] Find all technical papers here. » read more

HW Security: Pager, Walkie-talkie And Other Battery-Power System Attacks (U. of Florida)
By Technical Paper Link - 31 Jan, 2025 - Comments: 0

A new technical paper titled "When Everyday Devices Become Weapons: A Closer Look at the Pager and Walkie-talkie Attacks" was published by researchers at University of Florida. Abstract "Battery-powered technologies like pagers and walkie-talkies have long been integral to civilian and military operations. However, the potential for such everyday devices to be weaponized has largely been un... » read more

Chip Industry Technical Paper Roundup: Jan. 28
By Linda Christensen - 28 Jan, 2025 - Comments: 0

New technical papers recently added to Semiconductor Engineering’s library: [table id=400 /] Find all technical papers here. » read more

Chip Industry Week In Review
By The SE Staff - 24 Jan, 2025 - Comments: 0

The new Trump administration was quick to put a different stamp on the tech world: President Trump rescinded a long list of Biden’s executive orders, including those aimed at AI safety and the mandate for 50% EVs by 2030. Roughly 1.3 million EVs were sold in the U.S. in 2024, up 7.3% from 2023. The new administration announced $500 billion ($100 billion initially) in private sector in... » read more

Reverse Engineering Approach for Evaluating HW IP Protection ( U. of Florida, Indiana U.)
By Technical Paper Link - 23 Jan, 2025 - Comments: 0

A technical paper titled "Library-Attack: Reverse Engineering Approach for Evaluating Hardware IP Protection" was published by researchers at University of Florida and Indiana University. Abstract "Existing countermeasures for hardware IP protection, such as obfuscation, camouflaging, and redaction, aim to defend against confidentiality and integrity attacks. However, within the current thr... » read more

Chip Industry Week In Review
By The SE Staff - 13 Dec, 2024 - Comments: 0

The 2024 IEEE International Electron Devices Meeting (IEDM) was held this week, prompting a number of announcements from: imec: Proposed a new CFET-based standard cell architecture for the A7 node containing two rows of CFETs with a shared signal routing wall in between, allowing standard cell heights to be reduced from 4 to 3.5T, compared to single-row CFETs. Integrated indium pho... » read more

Tools Needed To Track, Catalog Hardware Vulnerabilities
By Adam Kovac - 05 Dec, 2024 - Comments: 0

Monitoring for cyberattacks is a key component of hardware-based security, but what happens afterward is equally important. Logging and cataloging identified hardware vulnerabilities to ensure they are not repeated is essential for security. In fact, thousands of weak points have been identified as part of the chip design process, and even posted publicly online. Nevertheless, many companies... » read more

Chip Industry Technical Paper Roundup: Nov. 25
By Linda Christensen - 25 Nov, 2024 - Comments: 0

New technical papers recently added to Semiconductor Engineering’s library: [table id=386 /] » read more

Systems-in-Package: Authenticated Partial Encryption Protocol For Secure Testing (U. of Florida)
By Technical Paper Link - 12 Nov, 2024 - Comments: 0

A new technical paper titled "GATE-SiP: Enabling Authenticated Encryption Testing in Systems-in-Package" was published by researchers at University of Florida and University of Central Florida. Abstract: "A heterogeneous integrated system in package (SIP) system integrates chiplets outsourced from different vendors into the same substrate for better performance. However, during post-integra... » read more

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