Chip Industry Week In Review


Don't have time to read this? Check out Semiconductor Engineering's Inside Chips podcast.  The U.S. Department of Commerce is investigating TSMC for potential export control violations involving Huawei chips, reports Reuters. The probe follows TechInsights' teardown of a Huawei AI accelerator chip last year. The foundry, meanwhile, maintains it has not shipped any chips to Huawei since 2020... » read more

Countermeasure Against Confidentiality And Integrity Attacks On Hardware IP (U. of Florida)


A new technical paper titled "HIPR: Hardware IP Protection through Low-Overhead Fine-Grain Redaction" was published by researchers at University of Florida. Abstract "Hardware IP blocks have been subjected to various forms of confidentiality and integrity attacks in recent years due to the globalization of the semiconductor industry. System-on-chip (SoC) designers are now considering a zero... » read more

Chip Industry Technical Paper Roundup: Apr. 7


New technical papers recently added to Semiconductor Engineering’s library: [table id=419 /] Find more semiconductor research papers here. » read more

Chip Industry Week In Review


Check out our new Inside Chips podcast. President Trump’s ‘Liberation Day’ tariffs were announced this week. The executive order stated that semiconductors and copper imports are not directly subject to the reciprocal tariff, although the exemption may be short-lived. Semiconductor equipment and tools were not mentioned, leaving the industry searching for clarification. Regardless, hig... » read more

LLM-based Agentic Framework Automating HW Security Threat Modeling And Test Plan Generation (U. of Florida)


A new technical paper titled "ThreatLens: LLM-guided Threat Modeling and Test Plan Generation for Hardware Security Verification" was published by researchers at University of Florida. Abstract "Current hardware security verification processes predominantly rely on manual threat modeling and test plan generation, which are labor-intensive, error-prone, and struggle to scale with increasing ... » read more

Chip Industry Week In Review


McKinsey issued a new report on the state of the chemical supply chain for semiconductors in the U.S., citing potential shortages of high-purity materials such as tungsten, aluminum and copper, lack of access to CMP slurries and photoresists for EUV, and rising competition for high-k precursors that can fetch higher prices outside of the U.S. CSIS weighed in on the U.S. goverment's recent ... » read more

Chip Industry Week In Review


The Malaysian government signed a deal with Arm to kickstart a chip design ecosystem. Until now, Malaysia has focused on packaging and test. Adding chip design represents a major change in focus. The country will pay SoftBank $250 million over 10 years for Arm’s chip design IP and train 10,000 engineers. Global chip sales reached $56 billion in January, up nearly 18% from the same period i... » read more

Chip Industry Week In Review


The chip industry is well on its way to hit $1 trillion in revenue by the end of its decade. Several analyst firms released 2024 annual results and 2025 predictions: Worldwide semiconductor revenue reached $626 billion in 2024, an 18% increase versus 2023, according to preliminary Gartner report. Memory revenue grew about 70%  2024 versus 2023. The firm forecasts that HBM will make up 19%... » read more

Chip Industry Technical Paper Roundup: Feb. 4


New technical papers recently added to Semiconductor Engineering’s library: [table id=403 /] Find all technical papers here. » read more

HW Security: Pager, Walkie-talkie And Other Battery-Power System Attacks (U. of Florida)


A new technical paper titled "When Everyday Devices Become Weapons: A Closer Look at the Pager and Walkie-talkie Attacks" was published by researchers at University of Florida. Abstract "Battery-powered technologies like pagers and walkie-talkies have long been integral to civilian and military operations. However, the potential for such everyday devices to be weaponized has largely been un... » read more

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