Manufacturing Bits: Sept. 18


Flexible nanowires The University of Glasgow has developed a new contact-printing system that prints and embeds silicon nanowires into flexible surfaces. The technology enables new forms of flexible electronics. It can be used to develop low-power circuits in flexible substrates, such as plastic, paper and fabrics. Researchers from the University of Glasgow have developed a new contact-p... » read more

Power/Performance Bits: Aug. 21


Physical neural network Engineers at UCLA built a physical artificial neural network capable of identifying objects as light passes through a series of 3D printed polymer layers. Called a "diffractive deep neural network," it uses the light bouncing from the object itself to identify that object, a process that consumes no energy and is faster than traditional computer-based methods of imag... » read more

Non-Traditional Chips Gaining Steam


Flexible hybrid electronics are beginning to roll out in the form of medical devices, wearable electronics and even near-field communications tags in retail, setting the stage for a whole new wave of circuit design, manufacturing and packaging that reaches well beyond traditional chips. FHE devices begin with substrates made of ceramics, glass, plastic, polyimide, polymers, polysilicon, stai... » read more

System Bits: Oct. 31


Software enables cars to auto-report diagnostics Thanks to researchers at MIT, it may soon be possible to hop into a ride-share car, glance at a smartphone app, and tell the driver that the car’s left front tire needs air, its air filter should be replaced next week, and its engine needs two new spark plugs. [caption id="attachment_409967" align="alignnone" width="300"] A new smartphone a... » read more

Manufacturing Bits: Aug. 1


Magnetic chips HRL Laboratories—an R&D venture between Boeing and General Motors—has been awarded a contract to develop a new class of magnetic integrated components. HRL has received the award from the Defense Advanced Research Project Agency (DARPA) under the Magnetic, Miniaturized, and Monolithically Integrated Components (M3IC) program. The goal is to develop new magnetic materials... » read more

Manufacturing Bits: March 8


5G mmWave consortium Amid a slowdown in the cell phone business, the market is heating up for perhaps the next big thing in wireless—5th generation mobile networks or 5G. Carriers, chipmakers and telecom equipment vendors are all rushing to get a piece of the action in 5G, which is the follow-on to the current wireless standard known as 4G or long-term evolution (LTE). Radio-frequency (RF... » read more

Manufacturing Bits: Feb. 11


Monolithic 3D SRAM project A group of companies have started a research project to propel the development of monolithic 3D chip technology. The research project, called COMPOSE³, involves the ability to stack transistors vertically. Within three years, the group hopes to unveil a proof of concept for building the world’s first 14nm, 3D-stacked SRAM cell based on III-V materials. Co... » read more