Chip Industry Week In Review

By The SE Staff - 28 Mar, 2025 - Comments: 0

McKinsey issued a new report on the state of the chemical supply chain for semiconductors in the U.S., citing potential shortages of high-purity materials such as tungsten, aluminum and copper, lack of access to CMP slurries and photoresists for EUV, and rising competition for high-k precursors that can fetch higher prices outside of the U.S. CSIS weighed in on the U.S. goverment's recent ... » read more

Chip Industry Technical Paper Roundup: Feb. 18

By Linda Christensen - 18 Feb, 2025 - Comments: 0

New technical papers recently added to Semiconductor Engineering’s library: [table id=406 /] Find all technical papers here. » read more

Uncore Frequency Scaling For Energy Optimization In Heterogeneous Systems (UIC, Argonne)

By Technical Paper Link - 12 Feb, 2025 - Comments: 0

A new technical paper titled "Exploring Uncore Frequency Scaling for Heterogeneous Computing" was published by researchers at University of Illinois Chicago and Argonne National Laboratory. Abstract "High-performance computing (HPC) systems are essential for scientific discovery and engineering innovation. However, their growing power demands pose significant challenges, particularly as sys... » read more

Chip Industry’s Technical Paper Roundup: October 24

By Liz Allan - 24 Oct, 2023 - Comments: 0

New technical papers added to Semiconductor Engineering’s library this week. [table id=157 /] More Reading Technical Paper Library home » read more

Chip Industry Week In Review

By The SE Staff - 20 Oct, 2023 - Comments: 0

By Susan Rambo, Gregory Haley, and Liz Allan SRC unfurled its Microelectronics and Advanced Packaging (MAPT) industry-wide 3D semiconductor roadmap, addressing such topics as advanced packaging, heterogeneous integration, analog and mixed-signal semiconductors, energy efficiency, security, the related foundational ecosystem, and more. The guidance is the collective effort of 300 individuals ... » read more

GNN-Based Pre-Silicon Power Side-Channel Analysis Framework At RTL Level

By Technical Paper Link - 16 Oct, 2023 - Comments: 0

A technical paper titled “SCAR: Power Side-Channel Analysis at RTL-Level” was published by researchers at University of Texas at Dallas, Technology Innovation Institute and University of Illinois Chicago. Abstract: "Power side-channel attacks exploit the dynamic power consumption of cryptographic operations to leak sensitive information of encryption hardware. Therefore, it is necessary t... » read more

Four Vertical Power Delivery Architectures For Emerging Packaging and Integration Platforms (UIC)

By Technical Paper Link - 16 Oct, 2023 - Comments: 0

A technical paper titled “Vertical Power Delivery for Emerging Packaging and Integration Platforms – Power Conversion and Distribution” was published by researchers at University of Illinois Chicago. Abstract: "Efficient delivery of current from PCB to point-of-load (POL) is a primary concern in modern high-power high-density integrated systems. Traditionally, a 48 V power signal is con... » read more

Week In Review: Automotive, Security, Pervasive Computing

By Liz Allan - 23 Jun, 2023 - Comments: 0

Stellantis and Foxconn formed a 50/50 joint venture called SiliconAuto, to be headquartered in the Netherlands. The goal is to close the gap between supply and demand for chips used in computer-controlled features and modules, especially for electric vehicles (EVs). The U.S. Department of Justice created a National Security Cyber Section within its National Security Division to increase the ... » read more

Technical Paper Round-up: July 11

By Linda Christensen - 11 Jul, 2022 - Comments: 0

New technical papers added to Semiconductor Engineering’s library this week. [table id=38 /] Semiconductor Engineering is in the process of building this library of research papers. Please send suggestions (via comments section below) for what else you’d like us to incorporate. If you have research papers you are trying to promote, we will review them to see if they are a ... » read more

Brain-Inspired Computing Device That Programs/RePrograms HW On Demand With Electrical Pulses

By Technical Paper Link - 06 Jul, 2022 - Comments: 0

Multiple academic and government institutions jointly developed a new computer device that can "program and program computer hardware on demand through electrical pulses," according to this Argonne National Lab news release. The device's key materials are neodymium, nickel and oxygen and is referred to as a perovskite nickelate. This new research paper titled "Reconfigurable perovskite nicke... » read more

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tag: University of Illinois Chicago

Chip Industry Week In Review

Chip Industry Technical Paper Roundup: Feb. 18

Uncore Frequency Scaling For Energy Optimization In Heterogeneous Systems (UIC, Argonne)

Chip Industry’s Technical Paper Roundup: October 24

Chip Industry Week In Review

GNN-Based Pre-Silicon Power Side-Channel Analysis Framework At RTL Level

Four Vertical Power Delivery Architectures For Emerging Packaging and Integration Platforms (UIC)

Week In Review: Automotive, Security, Pervasive Computing

Technical Paper Round-up: July 11

Brain-Inspired Computing Device That Programs/RePrograms HW On Demand With Electrical Pulses

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