Developing An Unbreakable Cybersecurity System

By John Koon - 01 Jun, 2023 - Comments: 0

Cyberattacks are increasing in frequency and sophistication, and the impact of those attacks is increasing almost exponentially as the amount and value of data continues to grow. Cybersecurity Ventures projected the annual cost of cybercrime will grow from $8 trillion in 2023 to $210.5 trillion by 2025, with no end in sight. On the target list are a slew of industrial and commercial segments... » read more

Technical Paper Round-Up: June 28

By Linda Christensen - 28 Jun, 2022 - Comments: 0

New technical papers added to Semiconductor Engineering’s library this week. [table id=35 /] Semiconductor Engineering is in the process of building this library of research papers. Please send suggestions (via comments section below) for what else you’d like us to incorporate. If you have research papers you are trying to promote, we will review them to see if they are a good fit f... » read more

Quantum Batteries Constructed of a Microcavity Enclosing a Molecular Dye

By Technical Paper Link - 22 Jun, 2022 - Comments: 0

Research paper titled "Superabsorption in an organic microcavity: Toward a quantum battery" from researchers at University of Adelaide (Australia), University of Sheffield (UK), Politecnico di Milano (Italy), University of St Andrews (UK), and Heriot-Watt University. Abstract (Partial) "Here, we implement experimentally a paradigmatic model of a quantum battery, constructed of a microcavity... » read more

What Quantum Batteries Have in Store

By David Jen - 22 Jun, 2022 - Comments: 0

Quantum battery technology is approaching an inflection point similar to the one quantum computing crossed a decade or so ago, escalating it from a theoretical curiosity to an engineering challenge worth solving. Quantum batteries exploit the strange physical laws of the very small — the quantum world — to gain performance advantages over classical batteries. Recent research on charging ... » read more

Power/Performance Bits: Jan. 21

By Jesse Allen - 21 Jan, 2020 - Comments: 0

Two-layer MRAM Scientists at Tokyo Institute of Technology propose a simpler MRAM construction that could perform faster with less power than conventional memories. The idea relies on unidirectional spin Hall magnetoresistance (USMR), a spin-related phenomenon that could be used to develop MRAM cells with an extremely simple structure. The spin Hall effect leads to the accumulation of elect... » read more

Manufacturing Bits: Jan. 22

By Mark LaPedus - 22 Jan, 2019 - Comments: 1

Open-source CVD Boise State University has developed an inexpensive chemical vapor deposition (CVD) system to enable the growth of two-dimensional (2D) materials. Using open-source designs and off-the-shelf components, researchers have developed an automated CVD system for $30,000 in hardware costs, according to Boise State in the journal PLoS One. 2D materials could enable a new class ... » read more

System Bits: May 9

By Ann Mutschler - 09 May, 2017 - Comments: 0

Graphene adopts exotic electronic states In a platform that may be used to explore avenues for quantum computing, MIT researchers have found that a flake of graphene, when brought in close proximity with two superconducting materials, can inherit some of those materials’ superconducting qualities. They reminded that in normal conductive materials such as silver and copper, electric curren... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

NAND Flash Targets 1,000 Layers

New techniques go beyond improved deposition and etching, but challenges stack up, too.

by Bryon Moyer

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.