Research Bits: December 5


Neuromorphic nanowires Researchers from UCLA and University of Sydney built an experimental computing system physically modeled after the biological brain. The device is composed of a tangled-up network of wires containing silver and selenium that were allowed to self-organize into a network of entangled nanowires on top of an array of 16 electrodes. The nanowire network physically reconfigure... » read more

Chip Industry’s Technical Paper Roundup: Nov. 15


New technical papers added to Semiconductor Engineering’s library this week. [table id=63 /] » read more

Semiconductor Manufacturing: Tradeoffs Between Performance, Energy Consumption & Cybersecurity Controls


A new research paper titled "Simulating Energy and Security Interactions in Semiconductor Manufacturing: Insights from the Intel Minifab Model" was published by researchers at Idaho National Laboratory, University of Texas at Austin, University of Texas at San Antonio and George Mason University. Abstract: "Semiconductor manufacturing is a highly complex. Fabrication plants must deal with r... » read more

Power/Performance Bits: Aug. 3


Efficient ADC Researchers at Brigham Young University, National Yang Ming Chiao Tung University, Texas Instruments, and University of California Los Angeles designed a new power-efficient high-speed analog-to-digital converter. The ADC consumes only 21 milli-Watts of power at 10GHz for ultra-wideband wireless communications, much lower than other ADCs that consume hundreds of milli-Watts to... » read more

Manufacturing Bits: Dec. 7


Cybersecurity for manufacturing The University of Texas at San Antonio (UTSA) has launched a center to address cybersecurity issues in the U.S. manufacturing sector. The center, called the Cybersecurity Manufacturing Innovation Institute (CyManII), is a $111 million public-private partnership. As part of the effort, UTSA will enter into a five-year corporative agreement with the U.S. Depart... » read more