tag: University of Texas

Week In Review: Manufacturing, Test
By Mark LaPedus - 01 Nov, 2019 - Comments: 0

Chipmakers China has created a new $29 billion fund to help advance its semiconductor sector, according to reports from Bloomberg and others. Here's another report. The The U.S. and China are in the midst of a trade war. This has prompted China to accelerate its efforts to become more self-sufficient in semiconductor design and production. This includes DRAMs as well as logic/foundry. -----... » read more

Manufacturing Bits: July 10
By Mark LaPedus - 10 Jul, 2019 - Comments: 0

Semicon West It’s Semicon West time again. Here’s the first wave of announcements at the event: Applied Materials has unveiled a pair of tools aimed at accelerating the industry adoption for new memories. First, Applied rolled out the Endura Clover MRAM PVD system. The system is an integrated platform for MRAM devices. Second, the company introduced the Endura Impulse PVD platform for P... » read more

Manufacturing Bits: Sept. 26
By Mark LaPedus - 26 Sep, 2017 - Comments: 0

Electrical twisted yarn The U.S. Air Force Research Laboratory (AFRL), the University of Texas at Dallas and Hanyan University in South Korea have developed a twisted yarn technology that can be used to generate or harvest electrical energy. The technology, dubbed “twistron” yarn, incorporates twisted bundles of tiny coiled carbon nanotubes. The nanotube-based twistron yarn works in con... » read more

Quality Issues Widen
By Ed Sperling - 06 Mar, 2017 - Comments: 0

As the amount of semiconductor content in cars, medical and industrial applications increases, so does the concern about how long these devices will function properly—and what exactly that means. Quality is frequently a fuzzy concept. In mobile phones, problems have ranged from bad antenna placement, which resulted in batteries draining too quickly, to features that take too long to load. ... » read more

Stacked Die Changes
By Ed Sperling - 21 Sep, 2016 - Comments: 0

Semiconductor Engineering sat down to discuss advanced packaging with David Pan, associate professor in the department of electrical and computer engineering at the University of Texas; Max Min, senior technical manager at [getentity id="22865" e_name="Samsung"]; John Hunt, senior director of engineering at ASE; and Sitaram Arkalgud, vice president of 3D portfolio and technologies at Invensas. ... » read more

Joint R&D Has Its Ups And Downs
By Jeff Dorsch - 07 Sep, 2016 - Comments: 0

As corporate spending on research and development dwindles, enterprises are reaching out to colleges and universities to supplement their R&D. And they often are finding eager partners in those endeavors, as professors and their graduate students look for help, financial and technical, in addressing long-term research projects. “Pure research is just a luxury no one can afford anymore,... » read more

Making Drones Secure
By John Edwards - 01 Sep, 2016 - Comments: 0

Critics have accused drones of creating multiple dangers, including invading privacy, colliding with other aircraft, threatening personal safety and even frightening livestock. Yet the biggest drone threat of all may turn out to be attacks made on the vehicles themselves. Drones, also known as UAVs (unmanned aerial vehicles) and UASs (unmanned aerial systems), need a variety of internal ... » read more

System Bits: Aug. 16
By Ann Mutschler - 16 Aug, 2016 - Comments: 0

Record-breaking quantum logic gate Reaching the benchmark required theoretically to build a quantum computer, University of Oxford researchers have achieved a quantum logic gate with record-breaking 99.9% precision. They reminded that quantum computers, which function according to the laws of quantum physics, have the potential to dwarf the processing power of today's computers, able to pro... » read more

Stacked Die Changes
By Ed Sperling - 27 Jul, 2016 - Comments: 0

Semiconductor Engineering sat down to discuss advanced packaging with David Pan, associate professor in the department of electrical and computer engineering at the University of Texas; Max Min, senior technical manager at Samsung; John Hunt, senior director of engineering at ASE; and Sitaram Arkalgud, vice president of 3D portfolio and technologies at Invensas. What follows are excerpts of tha... » read more

How To Build Systems In Package
By Ed Sperling - 15 Jun, 2016 - Comments: 0

The semiconductor industry is racing to define a series of road maps for semiconductors to succeed the one created by the ITRS, which will no longer be updated, including a brand new one focused on heterogeneous integration. The latest entry will establish technology targets for integration of heterogeneous multi-die devices and systems. It has the support of IEEE's Components, Packaging and... » read more

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