tag: Veeco

Week In Review: Manufacturing, Test
By Mark LaPedus - 01 Mar, 2019 - Comments: 1

Trade Trade tensions between the United States and China continue. The U.S. last year slapped a 10% tariff on $200 billion worth of Chinese goods. China retaliated with a 10% tariff on $60 billion of U.S. imports. The U.S. said it wants to increase the tariffs on Chinese goods to 25%, but that action has been postponed. This was the week that the U.S. was supposed to raise tariffs by 25%. I... » read more

Engineering Talent Shortage Now Top Risk Factor
By Mark LaPedus - 25 Feb, 2019 - Comments: 16

Demand is increasing for engineers and related technical fields in the IC industry, but companies are struggling to find enough talent. The problem is even worse in hot new markets such as AI and 5G, where competition is fierce for experienced workers. The talent shortfall starts with college graduates and professionals in the fields of science, technology, engineering and mathematics (STEM)... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 15 Feb, 2019 - Comments: 0

Chipmakers and OEMs South Korean chipmaker MagnaChip reported its results. It has also undertaken a strategic evaluation of the company's foundry business and Fab 4, the larger of the company's two 200mm fabs. “The strategic evaluation is expected to include a range of possible options, including, but not limited to, joint ventures, strategic partnerships as well as M&A possibilities. The co... » read more

Mapping The Impact Of Heat On Photonics
By Ed Sperling - 12 Feb, 2019 - Comments: 0

Heat and various types of noise can disrupt optical signals in silicon photonics applications, pushing light into frequencies that generally are filtered out. Unless those filters are adjusted, data may be lost or incomplete, and in the case of streaming data it may be impossible to reconstruct. But predicting when and how physical effects will affect light isn't always obvious, which makes ... » read more

Ion Beam Sputtering Deposition of Fluoride Thin Films
By Veeco - 12 Feb, 2019 - Comments: 0

By Aiko Ode, Veeco Instruments Thin film coatings for deep UV wavelengths are predominately produced by evaporation methods (thermal and Ebeam). Factors limiting the performance of evaporated films include surface roughness, porosity, absorption, and defect density. To enhance the films, they are typically deposited at high substrate temperatures (above 300°C.) The thermal stress created u... » read more

Lithography Challenges For Fan-out
By Mark LaPedus - 12 Feb, 2019 - Comments: 3

Higher density fan-out packages are moving toward more complex structures with finer routing layers, all of which requires more capable lithography equipment and other tools. The latest high-density fan-out packages are migrating toward the 1µm line/space barrier and beyond, which is considered a milestone in the industry. At these critical dimensions (CDs), fan-outs will provide better per... » read more

VCSEL Technology Takes Off
By Kevin Fogarty and Ed Sperling - 07 Feb, 2019 - Comments: 1

By Kevin Fogarty and Ed Sperling Vertical cavity surface emitting laser (VCSEL) technology, a proven but mostly niche technology until recently, is suddenly a very hot commodity thanks to the introduction of facial recognition in phones and other mobile devices. VCELS primarily have been used as a low-cost way of tracking movement and transfering data in computer mice, laser printers and ... » read more

More 2.5D/3D, Fan-Out Packages Ahead
By Mark LaPedus - 15 Jan, 2019 - Comments: 0

A new wave of 2.5D/3D, fan-out and other advanced IC packages is expected to flood the market over the next year. The new packages are targeted to address many of the same and challenging applications in the market, such as multi-die integration, memory bandwidth issues and even chip scaling. But the new, advanced IC packages face some technical challenges. And cost remains an issue as advan... » read more

Vapor-Deposited Octadecanethiol Masking Layer on Copper for Selective Hf3N4 ALD
By Veeco - 14 Jan, 2019 - Comments: 0

Full title: Vapor-deposited octadecanethiol masking layer on copper to enable area selective Hf3N4 atomic layer deposition on dielectrics studied by in situ spectroscopic ellipsometry Journal of Vacuum Science & Technology A 36, 031605 (2018); Authors: Laurent Lecordiera, Veeco Instruments Sebastiaan Herregods and Silvia Armini, IMEC Area-selective atomic layer deposition (AS-ALD) h... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 11 Jan, 2019 - Comments: 0

Trade and fab equipment The SEMI Industry Strategy Symposium (ISS) this week opened with the theme “Golden Age of Semiconductor: Enabling the Next Industrial Revolution.” The annual three-day conference gave the year’s first outlook of the global electronics manufacturing industry. Click here for a recap. SEMI and Imec are joining forces to drive innovation and deepen industry align... » read more

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