Advanced Packaging’s Progress


Shim Il Kwon, CTO at STATS ChipPAC, sat down with Semiconductor Engineering to discuss the current and future trends of chip packaging. What follows are excerpts of that conversation. SE: The outsourced semiconductor assembly and test (OSAT) vendors provide third-party IC-packaging and test services. What are the big challenges for OSATs today? Shim: The OSAT market is very competitive, w... » read more

Starting Point Is Changing For Designs


The starting point for semiconductor designs is shifting. What used to be a fairly straightforward exercise of choosing a processor based on power or performance, followed by how much on-chip versus off-chip memory is required, has become much more complicated. This is partly due to an emphasis on application-specific hardware and software solutions for markets that either never existed befo... » read more

System Bits: July 25


The language of glove In a development that allows the gestures in American Sign Language to be decoded, University of California San Diego researchers have developed a smart glove that also has application in virtual and augmented reality to telesurgery, technical training and defense. [caption id="attachment_232228" align="alignnone" width="300"] "The Language of Glove": a smart glove that ... » read more

5G Test Equipment Race Begins


Test and measurement vendors stand ready to help with the development and deployment of 5G wireless communications, as the technology is fine-tuned and tested in trials around the world. Juniper Research forecasts 5G operator-billed service revenues will rise to $269 billion by 2025, compared with $851 million in 2019, for a compound annual growth rate of 161% during the first seven years of... » read more

Biz Talk: ASICs


eSilicon CEO [getperson id="11145" comment="Jack Harding"] talks about the future of scaling, advanced packaging, the next big things—automotive, deep learning and virtual reality—and the need for security. [youtube vid=leO8gABABqk]   Related Stories Executive Insight: Jack Harding (Aug 2016) eSilicon’s CEO looks at industry consolidation, competition, China’s impact, an... » read more

When Will It Be Done?


Design teams have done remarkably well in getting chips out the door on time, despite growing complexity at each new node and an increase in the number of features and IP blocks that need to be integrated into designs. There has been plenty of grumbling, along with dire warnings about the future of Moore's Law and the impact of industry consolidation. The reality, though, is that the volume ... » read more

Virtual Reality Evolves Virtually


In 2016 we saw Virtual Reality hit the headlines all over again with a brand new wave of devices, applications and improvements on previous incarnations. With devices now shipping across dozens of manufacturers, price points and levels, it’s time to look at what happens next. We have of course discussed all the worthy, world changing applications of VR for healthcare, education and so on, ... » read more

2017: Manufacturing And Markets


While the industry is busy chatting about the end of Moore's Law and a maturing of the semiconductor industry, the top minds of many companies are having none of it. A slowdown in one area is just an opportunity, in another and that is reflected in the predictions for this year. As in previous years, Semiconductor Engineering will look back on these predictions at the end of the year to see ... » read more

Watch Out: Reality Is Set To Explode


Walk into any store right now (December 2016), and you can probably find a VR headset for $20. These will be a popular gift item this holiday season, but ultimately it may hurt the market if consumers have bad experiences with these bargain-basement VR headsets. There exists a considerable amount of confusion regarding the virtual reality, augmented reality, and mixed reality industries. Sem... » read more

System Bits: July 26


Mixing topology, spin MIT researchers are studying new compounds, such as topological insulators (TIs), which support protected electron states on the surfaces of crystals that silicon-based technologies cannot as part of the pursuit of material platforms for the next generation of electronics. They report new physical phenomena being realized by combining this field of TIs with the subfiel... » read more

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