The Challenges Of Building Inferencing Chips

By Ann Mutschler - 27 Feb, 2020 - Comments: 0

Putting a trained algorithm to work in the field is creating a frenzy of activity across the chip world, spurring designs that range from purpose-built specialty processors and accelerators to more generalized extensions of existing and silicon-proven technologies. What's clear so far is that no single chip architecture has been deemed the go-to solution for inferencing. Machine learning is ... » read more

Understanding SLAM (Simultaneous Localization And Mapping)

By Ed Sperling - 19 Feb, 2020 - Comments: 0

Amol Borkar, senior product manager for AI and computer vision at Cadence, talks with Semiconductor Engineering about mapping and tracking the movement of an object in a scene, how to identify key corners in a frame, how probabilities of accuracy fit into the picture, how noise can affect that, and how to improve the performance and reduce power in these systems. » read more

Priorities Shift In IC Design

By Ann Mutschler - 16 Jan, 2020 - Comments: 0

The rush to the edge and new applications around AI are causing a shift in design strategies toward the highest performance per watt, rather than the highest performance or lowest power. This may sound like hair-splitting, but it has set a scramble in motion around how to process more data more quickly without just relying on faster processors and accelerators. Several factors are driving th... » read more

Unsticking Moore’s Law

By Ed Sperling - 04 Feb, 2019 - Comments: 2

Sanjay Natarajan, corporate vice president at Applied Materials with responsibility for transistor, interconnect and memory solutions, sat down with Semiconductor Engineering to talk about variation, Moore's Law, the impact of new materials such as cobalt, and different memory architectures and approaches. What follows are excerpts of that conversation. SE: Reliability is becoming more of an... » read more

Foveated Rendering

By Arm - 12 Sep, 2018 - Comments: 0

Virtual Reality (VR) is becoming increasingly popular due to its ability to immerse the user into an experience. Those experiences can vary from watching a movie in a simulated theatre, having a look at your personal pictures as though they were paintings in a museum or finding yourself in front row seats of a huge sporting event. These specific experiences don’t stress the device hardware to... » read more

Market And Tech Inflections Ahead

By Ed Sperling - 27 Jun, 2018 - Comments: 0

Aart de Geus, chairman and co-CEO of Synopsys, sat down with Semiconductor Engineering to talk about the path to autonomous vehicles, industry dis-aggregation and re-aggregation, security issues, and who's going to pay for chips at advanced nodes. SE: All of a sudden we have a bunch of new markets opening up for electronics. We have assisted and autonomous driving, AI and machine learning, v... » read more

System Bits: May 22

By Ann Mutschler - 22 May, 2018 - Comments: 0

AI disruptions and benefits in the workplace According to Stanford University researchers, artificial intelligence offers both promise and peril as it revolutionizes the workplace, the economy and personal lives. Visiting scholar James Timbie of the Hoover Institution, who studies artificial intelligence and other technologies, said that in the workplace of tomorrow, many routine jobs now p... » read more

The Week in Review: IoT

By Jeff Dorsch - 20 Apr, 2018 - Comments: 0

Cybersecurity The U.S. and U.K. governments collaborated on an unprecedented message on Monday, together warning that Russian cyberattacks may extend beyond government and private organizations to individual homes and offices. The attacks may focus on Internet of Things devices, said Rob Joyce, the cybersecurity coordinator for the National Security Council, who soon after resigned from the Wh... » read more

Ultra-Low Power Memory IPs Using Mentor coolSRAM-6T Technology

By Mentor, a Siemens Business - 11 Apr, 2018 - Comments: 0

The use of embedded static random access memory (eSRAM) in complex ICs has significantly increased in the past three decades. This trend will continue with the growth of ICs designed for rapidly expanding markets such as automotive, virtual reality (VR) / augmented reality (AR), implantable medical devices, gaming, sensor hub, medical devices, wearable computing, data center, and artificial int... » read more

IP And Power

By Brian Bailey - 08 Mar, 2018 - Comments: 0

[getkc id="108" kc_name="Power"] is quickly becoming a major differentiator for products, regardless of whether they are connected to a wall outlet or dependent on a battery. At the same time, increasing amounts of a chips content comes from third-party [getkc id="43" kc_name="IP"]. So how do system designers ensure that the complete system has an optimal power profile, and what can they do to ... » read more

← Older posts Newer posts →

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?