tag: voltage drop

Designers Face Growing Problems With On-Chip Power Distribution
By Marc Swinnen - 13 Sep, 2018 - Comments: 0

The technology evolution in semiconductor manufacturing has led to chips with ever-higher power densities, which is leading to serious problems with on-chip power distribution. Specifically, the problems surrounding voltage drop—or IR drop (from V=IxR)—have become so acute that we have seen multiple companies starting to get back dead silicon from the fab. For example, a recent 7nm chip ... » read more

Tech Talk: 7nm Process Variation
By Ed Sperling - 17 Jan, 2018 - Comments: 0

Ankur Gupta, director of field applications at ANSYS, discusses process variation and the problems it can cause at 10/7nm and beyond. https://youtu.be/WHNjFr1Da6s » read more

The Implementation Of Embedded PVT Monitoring Subsystems In Today’s Cutting Edge Technologies
By Moortec - 13 Dec, 2017 - Comments: 0

This new whitepaper from Moortec takes a comprehensive look at the Implementation of Embedded PVT Monitoring Subsystems in Today’s Cutting Edge Technologies and how this can benefit today’s advanced node semiconductor design engineers by improving the performance and reliability of SoC designs. With advances in CMOS technology, and the scaling of transistor channel lengths to nanometer (nm)... » read more

Managing Voltage Drop At 10/7nm
By Ann Mutschler - 13 Apr, 2017 - Comments: 0

Power integrity is becoming a bigger problem at 10/7nm because existing tools such as static analysis no longer are sufficient. Power integrity is a function of static and dynamic voltage drop in the power delivery network. And until recently, static analysis did an effective job in measuring the overall robustness of PDN connectivity. As such, it is a proxy for PDN strength. The problem is ... » read more

Closing The Power Integrity Gap
By Ann Mutschler - 19 Oct, 2016 - Comments: 0

Voltage drop has always been a significant challenge. As far back as 130nm, specialist tools were being used to ensure that enough local decoupling capacitance (decap) cells were inserted in addition to larger decaps implemented around the SoC. But advanced nodes are complicating matters and further increasing complexity. These technological challenges, which underlie the power, performance ... » read more

Accurate Thermal Analysis, Including Thermal Coupling Of On-Chip Hot Interconnect
By Norman Chang - 15 Oct, 2015 - Comments: 0

Driven by rapid advancement in mobile/server computing and automotive/communications, SoCs are experiencing a fast pace of functional integration along with technology scaling. Advanced low power techniques are widely used, while meeting higher performance requirements using a variety of packaging technologies. The Internet of Things (IoT) is further opening up new applications with connected d... » read more

Two Constraints-Based Techniques To Address Power-Related Challenges In SoC Design
By Christine Young - 10 Sep, 2015 - Comments: 0

Power scheduling, power integrity targets, voltage drop—these are just a few of the power-related challenges you’re no doubt managing in your SoC designs. There aren’t any easy answers, but there are some emerging—and promising—techniques. Two such techniques, according to University of Toronto Professor Farid Najm, are constraints generation and constraints-based verification. “... » read more

How To Fix Common Power Problems
By Arvind Narayanan - 13 Aug, 2015 - Comments: 0

As the industry moves to ever more advanced technology nodes, managing power has emerged as a primary challenge in modern SoC design. With smaller nodes, the wires become taller and narrower, which increases the resistivity and leads to more pronounced voltage drop effects. Electro-migration effects are also more severe at advanced nodes, causing serious reliability concerns. Both RTL synthesis... » read more

Smart Early ASIC Design Prototyping And Analysis
By Sankar Ramachandran - 04 Dec, 2014 - Comments: 0

The Power Delivery Network (PDN) is the backbone of ASIC design. It is used to supply clean power to active circuits in the IC. Voltage drop on the power rails can result in degraded performance, making delivery of noise free supply to all design elements including die, package and PCB, a challenging task. With increasing competition in the market, delivering chips on time with 'first silico... » read more

Transient Current Crunch
By Ann Mutschler - 10 Oct, 2013 - Comments: 0

When Intel talks, people listen. So when Intel executive VP Dadi Perlmutter said in a keynote at ISSCC in 2012 that transient power noise was one of the most limiting aspects of the chip design process—and how the package and the board inductance are limiting how low they can take the supply voltage—it showed the gravity of the challenge of effectively managing transient power. Transient po... » read more

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