Causes Of Memory Unsafety

By Roddy Urquhart - 26 Oct, 2023 - Comments: 0

Memory unsafety is a characteristic of many of today’s systems. The root cause of buffer bounds vulnerabilities such as buffer overflows and over-reads is unsafe programming. Major software vendors consistently report memory unsafety problems. For example, the Chromium open-source browser project has stated that 69% of CVEs (Common Vulnerabilities and Exposures) reported relate to memory... » read more

Securing Chip Manufacturing Against Growing Cyber Threats

By Anne Meixner - 17 Aug, 2023 - Comments: 0

Semiconductor manufacturers are wrestling with how to secure a highly specialized and diverse global supply chain, particularly as the value of their IP and their dependence upon software increases — along with the sophistication and resources of the attackers. Where methodologies and standards do exist for security, they often are confusing, cumbersome, and incomplete. There are plenty of... » read more

Common Weakness Enumeration

By Ed Sperling - 06 Apr, 2022 - Comments: 0

Understanding potential design vulnerabilities up front can help prevent future cyberattacks. Jason Oberg, CTO at Tortuga Logic, talks with Semiconductor Engineering about why CWE is so important, when it needs to be considered, and why no hardware design is completely bulletproof. » read more

2021 Software Vulnerability Snapshot

By Synopsys - 02 Mar, 2022 - Comments: 0

The Synopsys Cybersecurity Research Center (CyRC) examined anonymized data from thousands of commercial software security tests performed by Synopsys application security testing services in 2020. The CyRC team measured this data against the 2021 OWASP Top 10 list of the most critical security risks to web applications. Key findings in the report include 97% of tests uncovered vul... » read more

Securing 5G And IoT With Fuzzing

By Synopsys - 04 Aug, 2021 - Comments: 0

5G will revolutionize many industries, with up to 100 times the speed, 100 times the capacity, and one-tenth the latency compared to 4G LTE. But in addition to providing superior performance, 5G expands the attack surface of apps and IoT devices that rely on this next-gen network. In addition to known security exploits, we’re bound to see unknown, novelty attacks. Fuzz testing (or fuzzing)... » read more

SoC Verification From Pre-Fabrication To The Over-the-Air Update

By OneSpin Solutions - 30 Jun, 2021 - Comments: 0

The recent new of attacks on system infrastructures serves to highlight that hardware vulnerabilities in the supply chain are not only possible but inevitable if proper precautions are ignored. Verification throughout the entire supply chain is necessary to ensure the safety and security of hardware. Starting as early as the pre-fabrication stage, vulnerabilities, if left unchecked, can be an o... » read more

Guiding Principles To Ensure Your Hardware Is Secure

By John Hallman - 12 Apr, 2021 - Comments: 0

The modern society relies on complex, intelligent electronic systems. Automotive, avionics, medical, smartphones, communication and 5G networks, critical infrastructure, data centers, and other applications are ever more dependent on integrated circuits (ICs) that deliver high performance, low power consumption, safety, cybersecurity, and continuity of operation. Hardware is so central to compe... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer