Edge Devices Require New Security Approaches

By Adam Kovac - 29 Aug, 2024 - Comments: 0

The diversity of connected devices and chips at the edge — the vaguely defined middle ground between the end point and the cloud — is significantly widening the potential attack surface and creating more opportunities for cyberattacks. The edge build-out has been underway for at least the past half-decade, largely driven by an explosion in data and increasing demands to process that data... » read more

SG2042 64-Core RISC-V CPU Versus Existing RISC-V HW And High Performance x86 CPUs

By Technical Paper Link - 13 Sep, 2023 - Comments: 0

A technical paper titled “Is RISC-V ready for HPC prime-time: Evaluating the 64-core Sophon SG2042 RISC-V CPU” was published by researchers at University of Edinburgh. Abstract: "The Sophon SG2042 is the world's first commodity 64-core RISC-V CPU for high performance workloads and an important question is whether the SG2042 has the potential to encourage the HPC community to embrace RISC-... » read more

Modeling and Testing Microarchitectural Leakage of CPU Exceptions (Microsoft, Vrije Universiteit Amsterdam)

By Technical Paper Link - 22 Aug, 2023 - Comments: 0

A new technical paper titled "Speculation at Fault: Modeling and Testing Microarchitectural Leakage of CPU Exceptions" was published by researchers at Microsoft and Vrije Universiteit Amsterdam. This paper was included at the recent 32nd USENIX Security Symposium. Abstract: "Microarchitectural leakage models provide effective tools to prevent vulnerabilities such as Spectre and Meltdown vi... » read more

Chips Getting More Secure, But Not Quickly Enough

By Ed Sperling - 22 May, 2023 - Comments: 0

Experts at the Table: Semiconductor Engineering sat down to talk about the impact of heterogeneous integration, more advanced RISC-V designs, and a growing awareness of security threats, with Mike Borza, Synopsys scientist; John Hallman, product manager for trust and security at Siemens EDA; Pete Hardee, group director for product management at Cadence; Paul Karazuba, vice president of marketin... » read more

What Future Processors Will Look Like

By Ed Sperling - 13 Jul, 2022 - Comments: 0

Mark Papermaster, CTO at AMD, sat down with Semiconductor Engineering to talk about architectural changes that are required as the benefits of scaling decrease, including chiplets, new standards for heterogeneous integration, and different types of memory. What follows are excerpts of that conversation. SE: What does a processor look like in five years? Is it a bunch of chips in a package? I... » read more

Why Hardware-Dependent Software Is So Critical

By Brian Bailey - 23 Jun, 2022 - Comments: 0

Hardware and software are two sides of the same coin, but they often live in different worlds. In the past, hardware and software rarely were designed together, and many companies and products failed because the total solution was unable to deliver. The big question is whether the industry has learned anything since then. At the very least, there is widespread recognition that hardware-depen... » read more

Sweeping Changes Ahead For Systems Design

By Ann Mutschler - 29 Jul, 2021 - Comments: 0

Data centers are undergoing a fundamental change, shifting from standard processing models to more data-centric approaches based upon customized hardware, less movement of data, and more pooling of resources. Driven by a flood of web searches, Bitcoin mining, video streaming, data centers are in a race to provide the most efficient and fastest processing possible. But because there are so ma... » read more

RISC-V: Will There Be Other Open-Source Cores?

By Ed Sperling - 06 Oct, 2020 - Comments: 5

Part 3: Semiconductor Engineering sat down to discuss the business and technology landscape for RISC-V with Zdenek Prikryl, CTO of Codasip; Helena Handschuh, a Rambus Security Technologies fellow; Louie De Luna, director of marketing at Aldec; Shubhodeep Roy Choudhury, CEO of Valtrix Systems; and Bipul Talukdar, North America director of applications engineering at SmartDV. What follows are exc... » read more

CXL Vs. CCIX

By Ed Sperling - 06 Dec, 2019 - Comments: 0

Kurt Shuler, vice president of marketing at ArterisIP, explains how these two standards differ, which one works best where, and what each was designed for. » read more

Survival Of The Cheapest?

By Brian Bailey - 26 Sep, 2019 - Comments: 0

We all want the best solution to win, but that rarely happens. History is littered with products that were superior to the alternatives and yet lost out to a lessor rival. I am sure several examples are going through your mind without me having to list them. It is normally the first to volume that wins, often accelerated by copious amounts of marketing dollar to help push it against headwinds. ... » read more

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Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

New AI Processors Architectures Balance Speed With Efficiency

Hot Chips 24: Large language models ratchet up pressure for sustainable computing and heterogeneous integration; data management becomes key differentiator.