What’s The Best Advanced Packaging Option?


As traditional chip designs become more unwieldy and expensive at each node, many IC vendors are exploring or pursuing alternative approaches using advanced packaging. The problem is there are too many advanced packaging options on the table already, and the list continues to grow. Moreover, each option has several tradeoffs and challenges, and all of them are still relatively expensive. ... » read more

The Race To Next-Gen 2.5D/3D Packages


Several companies are racing each other to develop a new class of 2.5D and 3D packages based on various next-generation interconnect technologies. Intel, TSMC and others are exploring or developing future packages based on one emerging interconnect scheme, called copper-to-copper hybrid bonding. This technology provides a way to stack advanced dies using copper connections at the chip level,... » read more

Blog Review: Aug. 29


Mentor's Joe Hupcey III addresses inconclusive results in formal verification with tips on how to reduce the complexity of “assumption” properties to make them easier for the formal engines to digest and reach a solution. Cadence's Meera Collier looks beyond the immediate appeal of autonomous cars to the broader social implications of urban sprawl, public transit funding, and gentrificat... » read more

Week In Review: Manufacturing, Test


Trade wars After opposing $34 billion in U.S. trade tariffs on behalf of the U.S. semiconductor manufacturing industry, Jonathan Davis, global vice president of industry advocacy at SEMI, recently spoke out against an additional $16 billion in duties on Chinese goods. The tariffs do little to address U.S. concerns over IP loss, according to SEMI. Over the past month, SEMI has also submitte... » read more

The Week In Review: Manufacturing


Chipmakers Recently, Intel announced plans to invest more than $7 billion to complete its previously-announced fab in Chandler, Ariz. Targeted for 7nm processes, Fab 42 will be completed in 3 to 4 years. As reported, the fab announcement was made by U.S. President Donald Trump and Intel CEO Brian Krzanich at the White House. There is more to the story. Typically, Intel has two fabs for a gi... » read more