Chip Industry Week In Review

By The SE Staff - 11 Apr, 2025 - Comments: 0

Don't have time to read this? Check out Semiconductor Engineering's Inside Chips podcast. The U.S. Department of Commerce is investigating TSMC for potential export control violations involving Huawei chips, reports Reuters. The probe follows TechInsights' teardown of a Huawei AI accelerator chip last year. The foundry, meanwhile, maintains it has not shipped any chips to Huawei since 2020... » read more

Chip Industry Week In Review

By The SE Staff - 18 Oct, 2024 - Comments: 0

Arm joined forces with Korea's Samsung Foundry, ADTechnology, and Rebellions to create a CPU chiplet platform for AI training and inference. The new chiplet will be based on Samsung's 2nm gate-all-around technology. Intel and AMD, arch competitors for decades, formed an x86 ecosystem advisory group to collaborate on architectural interoperability and simplify software development. Samsung... » read more

Chip Industry Technical Paper Roundup: Sept. 17

By Linda Christensen - 17 Sep, 2024 - Comments: 0

New technical papers recently added to Semiconductor Engineering’s library: [table id=356 /] More ReadingTechnical Paper Library home » read more

Flip-Chip Bonding Technique To Excite LN Resonators Via Noncontact Electrodes (Yale)

By Technical Paper Link - 09 Sep, 2024 - Comments: 0

A new technical paper titled "Noncontact excitation of multi-GHz lithium niobate electromechanical resonators" was published by researchers at Yale University. Abstract "The demand for high-performance electromechanical resonators is ever-growing across diverse applications, ranging from sensing and time-keeping to advanced communication devices. Among the electromechanical materials being ... » read more

Is There Any Hope For Asynchronous Design?

By Brian Bailey - 25 Apr, 2024 - Comments: 6

In an era when power has become a fundamental design constraint, questions persist about whether asynchronous logic has a role to play. It is a design style said to have significant benefits and yet has never resulted in more than a few experiments. Synchronous design utilizes a clock, where the clock frequency is set by the longest and slowest path in the design. That includes potential var... » read more

Photonic Compact Chip That Seamlessly Converts Light Into Microwaves (NIST, et al.)

By Technical Paper Link - 15 Mar, 2024 - Comments: 0

A new technical paper titled "Photonic chip-based low-noise microwave oscillator" was published by researchers at NIST, University of Colorado Boulder, California Institute of Technology, UCSB, University of Virginia and Yale University. Abstract "Numerous modern technologies are reliant on the low-phase noise and exquisite timing stability of microwave signals. Substantial progress has b... » read more

Chip Industry Week In Review

By The SE Staff - 19 Jan, 2024 - Comments: 0

By Jesse Allen, Gregory Haley, and Liz Allan Synopsys will acquire Ansys for about $35 billion in cash and stock. The deal will boost Synopsys' multi-physics simulation capabilities, which are essential for complex 3D-IC designs, where thermal density can have significant repercussions. The acquisition is expected to be finalized in the first half of 2025. Worldwide semiconductor revenue ... » read more

Money Pours Into New Fabs And Facilities

By Liz Allan - 03 Jan, 2024 - Comments: 0

Fabs, packaging, test and assembly, and R&D all drew major funding in 2023. Companies poured money into offshore locations, such as India and Malaysia, to access a larger workforce and lower costs, while also partnering with governments to secure domestic supply chains amid ongoing geopolitical turmoil. Looking ahead, artificial intelligence (AI), quantum computing, and data applications... » read more

Chip Industry Technical Paper Roundup: Jan 2

By Linda Christensen - 02 Jan, 2024 - Comments: 0

New technical papers added to Semiconductor Engineering’s library this week. [table id=180 /] More ReadingTechnical Paper Library home » read more

Mixed SRAM And eDRAM Cell For Area And Energy-Efficient On-Chip AI Memory (Yale Univ.)

By Technical Paper Link - 21 Dec, 2023 - Comments: 0

A new technical paper titled "MCAIMem: a Mixed SRAM and eDRAM Cell for Area and Energy-efficient on-chip AI Memory" was published by researchers at Yale University. Abstract: "AI chips commonly employ SRAM memory as buffers for their reliability and speed, which contribute to high performance. However, SRAM is expensive and demands significant area and energy consumption. Previous studies... » read more

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Chip Industry Week In Review

Chip Industry Week In Review

Chip Industry Technical Paper Roundup: Sept. 17

Flip-Chip Bonding Technique To Excite LN Resonators Via Noncontact Electrodes (Yale)

Is There Any Hope For Asynchronous Design?

Photonic Compact Chip That Seamlessly Converts Light Into Microwaves (NIST, et al.)

Chip Industry Week In Review

Money Pours Into New Fabs And Facilities

Chip Industry Technical Paper Roundup: Jan 2

Mixed SRAM And eDRAM Cell For Area And Energy-Efficient On-Chip AI Memory (Yale Univ.)

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