tag: yield

Silent Data Corruption
By Ed Sperling - 12 Dec, 2022 - Comments: 0

Defects can creep into chip manufacturing from anywhere, but the problem is getting worse at advanced nodes and in advanced packages where reduced pin access can make testing much more difficult. Ira Leventhal, vice president of U.S. Applied Research and Technology at Advantest America, talks about what’s causing these so-called silent data errors, how to find them, and why it now requires ma... » read more

Next Steps For Improving Yield
By Laura Peters - 08 Nov, 2022 - Comments: 0

Chipmakers are ramping new tools and methodologies to achieve sufficient yield faster, despite smaller device dimensions, a growing number of systematic defects, immense data volumes, and massive competitive pressure. Whether a 3nm process is ramping, or a 28nm process is being tuned, the focus is on reducing defectivity. The challenge is to rapidly identify indicators that can improve yield... » read more

How To Improve Yield Ramp For New Designs And Technology Nodes
By Jayant D'Souza - 08 Nov, 2022 - Comments: 0

The complicated silicon defect types and defect distribution of new IC manufacturing technologies can result in very low yield for new designs and technology nodes. During technology qualification using test chips, scan chain failures account for most of the chip failures. Diagnosing those scan chain defects is a powerful way to uncover new and systematic defects. The chip maker’s goal is ... » read more

Test Connections Clean Up With Real-Time Maintenance
By Anne Meixner - 08 Nov, 2022 - Comments: 0

Test facilities are beginning to implement real-time maintenance, rather than scheduled maintenance, to reduce manufacturing costs and boost product yield. Adaptive cleaning of probe needles and test sockets can extend equipment lifetimes and reduce yield excursions. The same is true for load board repair, which is moving toward predictive maintenance. But this change is much more complicate... » read more

Bump Co-Planarity And Inconsistencies Cause Yield, Reliability Issues
By Karen Heyman - 11 Oct, 2022 - Comments: 0

Bumps are a key component in many advanced packages, but at nanoscale levels making sure all those bumps have a consistent height is an increasing challenge. Without co-planarity, surfaces may not properly adhere. That can reduce yield if the problem is not identified in packaging, or it can cause reliability problems in the field. Identifying those issues requires a variety of process steps... » read more

Equipment Suppliers Brace For GaN Market Explosion
By Adele Hars - 18 Aug, 2022 - Comments: 0

A huge GaN market is opening up, driven by consumer devices and the need for greater energy efficiency across many applications. Suppliers are ready, but to fully compete with SiC in high-voltage automotive applications will require further technological developments in power GaN (gallium nitride). Still, the 2020s mark a very high-growth phase for GaN markets. Revenues in the power GaN mark... » read more

How Overlay Keeps Pace With EUV Patterning
By Laura Peters - 09 Aug, 2022 - Comments: 1

Overlay metrology tools improve accuracy while delivering acceptable throughput, addressing competing requirements in increasingly complex devices. In a race that never ends, on-product overlay tolerances for leading-edge devices are shrinking rapidly. They are in the single-digit nanometer range for the 3nm generation (22nm metal pitch) devices. New overlay targets, machine learning, and im... » read more

Review of Bumpless Build Cube Using Wafer-on-Wafer & Chip-on-Wafer for Tera-Scale 3D Integration
By Technical Paper Link - 20 Jun, 2022 - Comments: 0

New research paper titled "Review of Bumpless Build Cube (BBCube) Using Wafer-on-Wafer (WOW) and Chip-on-Wafer (COW) for Tera-Scale Three-Dimensional Integration (3DI)" from researchers at Tokyo Institute of Technology and others. Abstract "Bumpless Build Cube (BBCube) using Wafer-on-Wafer (WOW) and Chip-on-Wafer (COW) for Tera-Scale Three-Dimensional Integration (3DI) is discussed. Bum... » read more

Driving Toward More Rugged, Less Expensive SiC
By Katherine Derbyshire - 19 May, 2022 - Comments: 0

Silicon carbide is gaining traction in the power semiconductor market, particularly in electrified vehicles, but it's still too expensive for many applications. The reasons are well understood, but until recently SiC was largely a niche technology that didn't warrant the investment. Now, as demand grows for chips that can work in high-voltage applications, SiC is getting a much closer look. ... » read more

Where And When End-to-End Analytics Works
By Anne Meixner - 10 May, 2022 - Comments: 0

With data exploding across all manufacturing steps, the promise of leveraging it from fab to field is beginning to pay off. Engineers are beginning to connect device data across manufacturing and test steps, making it possible to more easily achieve yield and quality goals at lower cost. The key is knowing which process knob will increase yield, which failures can be detected earlier, and wh... » read more

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