Blog Review: Feb. 12


Complexity is growing by process node, by end application, and in each design. The latest crop of blogs points to just how many dependencies and uncertainties exist today, and what the entire supply chain is doing about them. Mentor's Shivani Joshi digs into various types of constraints in PCBs. Cadence's Neelabh Singh examines the complexities of verifying a lane adapter state machine in... » read more

Logic Chip, Heal Thyself


If a single fault can kill a logic chip, that doesn’t bode well for longevity of complex multi-chip systems. Obsolescence in chips is not just an industry ploy to sell more chips. It is a fact of physics that chips don’t last more than a few years, especially if overheated, and hit with higher voltage than it can stand. The testing industry does a great job finding defects during manufac... » read more

Failure Analysis Becoming Critical To Reliability


Failure analysis is rapidly becoming a complex, costly and increasingly time-consuming must-do task as demand rises for reliability across a growing range of devices used in markets ranging from automotive to 5G. From the beginning, failure analysis has been about finding out what went wrong in semiconductor design and manufacturing. Different approaches, tools and equipment have improved ov... » read more

6 Signs You Need A Yield Management System


We often speak to companies who don’t know if they need yield management software yet. While most semiconductor companies need to invest in yield management, there could be instances where you’ll get by without one for a while. This article is for companies that use an internal option (such as Excel or JMP) and those who don’t have yield management at all. We will share the six most obvio... » read more

The Impact Of Test Engineers


As testing is at the end of each project, it’s often seen as a non-value-added necessity that just needs to be done. This is why Test Engineers often feel overlooked and undervalued. Previously, we explained why engineering managers should value their test engineers, and told them how to get the most out of their teams. Today we’ll explore how test engineers can learn to understand the... » read more

CEO Outlook: 2020 Vision


The start of 2020 is looking very different than the start of 2019. Markets that looked hazy at the start of 2019, such as 5G, are suddenly very much in focus. The glut of memory chips that dragged down the overall chip industry in 2019 has subsided. And a finely tuned supply chain that took decades to develop is splintering. A survey of CEOs from across the industry points to several common... » read more

Gaps Emerge In Test And Analytics


Sensor and process drift, increased design complexity, and continued optimization of circuitry throughout its lifetime are driving test and analytics in new directions, requiring a series of base comparisons against which equipment and processes can be measured. In the design world this type of platform is called a digital twin, but in the test world there is no equivalent today. And as more... » read more

A Holistic Approach To Yield Management


At yieldHUB we work with consultants and semiconductor experts, like André van de Geijn, semiconductor expert and author of Collaboratism. He supports our customers on the west coast of the US. We asked him about the benefits of various yield management solutions (YMS). In this article we will explain the benefits with insights from André. Today, people look at their current problem an... » read more

Testing In Context Gaining Ground


Testing in context is beginning to gain wider appeal as chip complexity increases, and as ICs are deployed in more safety-critical and mission-critical applications. While design in context has been the norm for SoCs for some time, a similar approach in test has been slow going. Cell-aware testing technology was first described a decade ago, and since then its adoption has been modest. But w... » read more

Week In Review: Manufacturing, Test


Chipmakers United Microelectronics Corp. (UMC) has announced the readiness of its new 22nm process. The process enables new 22nm designs or allows customers to migrate from 28nm to 22nm. UMC’s 22nm maintains its existing 28nm design architectures. UMC's 22nm process features a 10% area reduction, better power-to-performance ratio and enhanced RF capabilities, compared to the company’s 2... » read more

← Older posts