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Transient Thermal Analysis For M.2 SSD Thermal Throttling: Detailed CFD Model vs Network-Based Model

Two system-level modeling approaches to model and simulate M.2 2280 SSD thermal throttling behavior in a typical laptop working environment.

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Solid State Drive (SSD) technology continues to advance toward smaller footprints with higher bandwidth and adoption of new I/O interfaces in the PC market segment. Power performance requirements are tightening in the design process to address specific requirement along with the development of SSD technology. To meet this aggressive requirement of performance, one major issue is thermal throttling. As the NAND and ASIC junction temperatures approach their safe operating limits, performance throttling is triggered and thus power consumption would drop accordingly. Therefore, robust thermal understanding on system level as well as reliable and fast thermal prediction are becoming essential in the process of system thermal design to optimize performance in a quick turnaround manner.

In this paper, we present two different modeling approaches on the system level to model and simulate M.2 2280 SSD thermal throttling behavior in a typical laptop working environment. One approach is to establish a detailed three dimensional CFD (computational fluid dynamics) model using traditional CFD tools. In this model, the motherboard is enclosed in a case or chassis. Major heat sources of components and packages on the motherboard are considered including CPU, GPU, M.2 SSD, DRAM etc.

Advanced cooling solutions like heat pipe and blowers are also modeled. In order to accurately capture thermal behavior of the SSD, detailed structure and geometry of NAND, PMIC and ASIC packages are included. Both natural and force convection as well as radiation are considered in this model. Both steady state and transient simulation results are presented in this paper.

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