Technical challenges in achieving defect-free M2 lines with SAQP.
This paper uses Virtual Fabrication to assess the Imec 7nm node (iN7) Self-Aligned Quadruple Patterning (SAQP) integration scheme for the 16nm half-pitch Metal 2 line formation. We first present the technical challenge of obtaining defect-free M2 lines with SAQP, and then provide a solution to achieve a <1% failure rate using a combination of Advanced Process Control and Virtual Fabrication. To read more, click here.
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