Biden’s new cybersecurity strategy released; AAA: Drivers fear self-driving cars; UMC new 28nm; Infineon acquires GaN Systems, leads auto supercomputing project; digital twins for cybersecurity.
The Biden administration released a National Cybersecurity Strategy report this week, calling on the tech community to shoulder much more responsibility, placing “responsibility on those within our digital ecosystem that are best positioned to reduce risk and shift the consequences of poor cybersecurity away from the most vulnerable in order to make our digital ecosystem more trustworthy.” The 35-page report emphasizes the responsibilities of software companies, and discusses accelerating investments in the “replacement of hardware, software, and services that can be easily compromised by quantum computers.”
Digital twins may a good tool for strengthening a system’s cybersecurity. Researchers at National Institute of Standards and Technology (NIST) and the University of Michigan created a cybersecurity framework that uses digital twin technology, machine learning, and human expertise to warn system users when an indication of a cyberattacks is present.
The American Automobile Association reported that drivers are growing more apprehensive about self-driving cars. Some 68% of drivers surveyed in 2023 said they were afraid of self-driving cars, up from 55% in 2022. “AAA believes automakers must be diligent in creating an environment that promotes the use of more advanced vehicle technologies in a secure, reliable, and educational manner. This includes the consistent naming of vehicle systems available to consumers today,” said the auto club.
Infineon is coordinating a wide-scale research initiative that will develop an automotive supercomputing platform for automobiles. Working on the project will be 30 research partners from industry and universities, with support the German government’s large scale funding initiative for digitalization of auto-mobility. The project will use high-performance chips qualified for automotive applications, including finFETs. In addition, Infineon will acquire GaN Systems for US$830 million, a move that will further strengthen Infineon’s place in the power semiconductor market. Gallium nitride (GaN) is the wide-bandgap material used in fast chargers. GaN has higher power density, higher efficiency, and size reductions, especially at higher switching frequencies. Headquartered in Ottawa, Canada, GaN Systems develops GaN-based solutions for power conversion.
Ford applied for a patent for a networked automotive repo system that can lock out a driver who is delinquent on payments. The patent also stipulates that if the vehicle is semi-autonomous, it can drive itself back to the finance company or dealership. Meanwhile, Ford’s newly formed subsidiary, Latitude AI, is developing new “hands-free, eye-off-the-road” automated driving systems, focused on personally owned vehicles.
JCET Group is providing advanced packaging HVM solutions for 4D millimeter-wave (mmWave) radar to some of its customers. The radar is being used in automotive electronic applications, such as assisted and autonomous driving. The advanced packaging types used for mmWave include flip chip chip scale packages (FCCSP) and fan-out wafer level packages (FO-WLP).
Protecting automobiles from cyberattacks is now on everyone’s radar. With attacks on cars becoming more widespread and the number of attack surfaces increasing, the issue is critical to passenger safety as well as privacy. With no way to know when or where breaches will occur, multiple security measures are required, from hardware-software co-design to supply chain management.
JEDEC formed an Automotive Steering Subcommittee to investigate memory technologies and recommend solutions specifically for automotive applications.
Wuhan, China-based SiEngine Technology said it completed a 500 million yuan ($72.5 million) Series A+ funding round in the fourth quarter of last year, according to Reuters. The company, a joint venture between Arm China and ECARX Holdings, makes advanced automotive chips.
Arteris IP and SiFive are working together to speed up RISC-V SoC designs used in edge AI through the combination of the SiFive’s Intelligence processor IP and Arteris’ Ncore interconnect IP.
United Microelectronics Corporation (UMC) unveiled a new offering in its 28nm embedded high voltage (eHV) technology. The 28eHV+ platform has greater power efficiency and visual quality needed in display drivers for next-generation displays in smartphones, virtual and augmented reality devices, and IoT. The 28eHV+ has the smallest SRAM bit cells, which makes the chip sizes smaller, according to UMC.
Data production and use is exploding. One technique to deal with data is to process it closer to the source, saving the energy and time cost of moving the data. Processing more data in more places while minimizing its movement is becoming a requirement and a challenge, and new architectures are being designed to deal with data.
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