Blog Review: Aug. 24

Internet’s future; creeping elegance; Type-C audio; seismic supercomputers; neuroprosthetics; ARM architecture update; AR/VR.


Cadence’s Christine Young relates a talk by IEEE president-elect Karen Bartleson, who stresses the need for technologists and policy makers to work together to shape the future of the Internet.

In his latest video, Mentor’s Colin Walls muses about creeping elegance in embedded software development.

Synopsys’ Michael Posner considers whether USB Type-C should replace the 3.5mm headphone jack.

Rambus’ Aharon Etengoff looks at the growing challenges of building supercomputers capable of seismic processing.

The NSF is looking for ways to radically change electronic, photonic and acoustic devices, in this week’s top five tech picks from Ansys’ Sandy Adam. Plus, getting a lift from a flying taxi and the potential of neuroprosthetics.

ARM’s Nigel Stephens digs into the details of the recently announced update to the ARMv8-A architecture, the Scalable Vector Extension.

Applied’s Om Nalamasu considers what developments are necessary to push augmented and virtual reality.

NXP’s Stefan Barbu sees five avenues by which governments can use technology improve citizens’ lives.

Cadence’s Paul McLellan looks at the history of simulation in three phases.

If you click past security warnings without paying attention to them, Synopsys’ Robert Vamosi says you’re not alone.

And don’t miss the blogs featured in last week’s Manufacturing, Design & Test newsletter:

Editor In Chief Ed Sperling predicts that shifting architectures will alter the power structure in the semiconductor industry.

Executive Editor Mark LaPedus examines the complaints filed by the EU and U.S. government against China over raw materials.

Applied Materials’ Mike Chudzik digs into parasitic resistance and capacitance in finFET scaling.

Mentor Graphics’ Phil Brooks looks at how to improve the accuracy of layout-based simulation results and avoid phantom nets.

Coventor’s Mattan Kamon zeroes in on improvements in phone network data capacity with RF-MEMS.

Semico Research’s Joanne Itow contends that steady, single-digit growth that keeps older fabs busy is good for the entire industry.

SEMI’s Bettina Weiss points to a changing landscape with dampened chip outlook and a resurgence of 200mm fabs.