A New Class Of Actuators Mimicking Human Muscle


Developing robots with human-like muscles that produce autonomous movement is not possible using traditional rigid, high-voltage electronics. However, recent research funded by FlexTech, a SEMI Technology community, shows promise in incorporating microcircuits to do just that by directly controlling and operating HASEL actuators. The innovation could guide intelligent, goal-oriented robots in ... » read more

MEMS & Sensors Market Forecast: Impact Of Semiconductor Industry Slowdown


Of all technologies, MEMS and sensors stand out for their far-reaching promise to improve lives across segments such as Internet of Things (IoT), wearables, smart home, digital health, precision agriculture, autonomous vehicles, robotics, and environmental monitoring. Little wonder, then, that the growth of the MEMS and sensor design and manufacturing industry is among the hottest topics at ... » read more

Supply Chain Resilience And Agility: Two Critical Sides Of The Same Coin


Over the past three years of major global disruptions, the supply chains of many industries have sharpened their focus on resilience. Today, discussions on electronics industry resilience center on redundancy across suppliers, multi-tier supplier mapping, nearshoring, reducing the number of unique parts, regionalizing supply chains, and business continuity planning. Resilience connotes a st... » read more

Unleashing the Potential of Compound Semiconductors: Industry Leaders Collaborate at SEMICON Taiwan 2022 to Create Ecosystem


Delivering high-speed processing over 100 times faster than silicon, compound semiconductors have made the devices a magnet for developers of leading-edge technologies out to maximize performance in key segments including automotive, data centers and communications. With the rising profile of compound semiconductors as the backdrop, leading experts gathered at the Power and Opto Semiconductor F... » read more

As Chiplets Go Mainstream, Chip Industry Players Collaborate to Overcome New Development Challenges


The semiconductor industry is building a comprehensive chiplet ecosystem to seize on the advantages of the devices over traditional monolithic system-on-chips (SoCs) such as improved performance, lower power consumption, and greater design flexibility. With heterogeneous integration (HI) presenting significant challenges, collaboration to fulfill the potential of chiplets has become even more i... » read more

Supply Chain Collaboration Key To Making Chip Industry More Sustainable


Coming in the wake of the COP27, the Smart and Green Manufacturing Summit at SEMICON Europa 2022 (Munich, 15-17 November) had a timely focus on the semiconductor industry’s contribution to meeting the United Nations’ target of limiting global warming to 1.5°C above pre-industrial levels. However, in an industry as large and valuable as semiconductors, social as well as environmental imp... » read more

Driving Toward Net-Zero: Key Takeaways From Semiconductor Sustainability Summit


To address the climate crisis, countries around the world are pursuing ambitious targets to achieve net-zero carbon emissions by 2050 under the Paris Agreement. In March, Taiwan redoubled its focus on decarbonization by announcing its net-zero pathway, while its Environmental Protection Administration (EPA) under the Executive Yuan is reshaping the Greenhouse Gas Reduction and Management Act in... » read more

Wall Street View Of EDA Industry


Jay Vleeschhouwer, managing director of Griffin Securities, has followed the electronic design automation (EDA) industry as a leading financial analyst for 25 years and is a popular speaker at the annual Design Automation Conference (DAC). I spoke with Vleeschhouwer after attending his presentation "The State of EDA: A View from Wall Street" at this year’s DAC. Bob Smith: According t... » read more

Additive Techniques For Flexible Hybrid Electronics Packaging And Integration With Human Body


By Gity Samadi and Paul Semenza Flexible hybrid electronics (FHE) has spawned the development of novel packaging techniques to overcome the application limitations of the rigid boards, high-temperature solders, bulky component packages, and insertion processes used in traditional printed circuit boards. Thin, flexible substrates, bare die, and combinations of printed and small-format package... » read more

Smart Manufacturing And Advanced Technical Service


SEMI spoke with Eyal Shekel, senior vice president of Service Strategy and Excellence at Tokyo Electron Limited, about the impact of artificial intelligence (AI) on smart manufacturing and how other fab solutions for smarter process tools are advancing semiconductor manufacturing. SEMI: AI technology is considered a key enabler for smart manufacturing. What are the latest trends? Shekel:... » read more

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