Deep Learning Market Forces


Last week, eSilicon participated in a deep learning event at the Computer History Museum – “ASICs Unlock Deep Learning Innovation.” Along with Samsung, Amkor Technology and Northwest Logic, we explored how our respective companies form an ecosystem to develop deep learning chips for the next generation of applications. We also had a keynote presentation on deep learning from Ty Garibay, C... » read more

Deconstructing Deep Learning


I discuss AI and deep learning a lot these days. The discussion usually comes back to “what is a deep learning chip?” These devices are basically hardware implementations of neural networks. While neural nets have been around for a while, what’s new is the performance advanced semiconductor technology brings to the party. Applications that function in real time are now possible. But wh... » read more

In Case You Missed It


We recently held two very successful seminars in Tokyo and Shanghai. Samsung Memory presented their HBM2 solutions, Samsung Foundry talked about their advanced 14nm FinFET solutions, ASE Group reviewed their advanced 2.5D packaging solutions, eSilicon presented our ASIC and 2.5D design/implementation and IP solutions, Rambus detailed their high-performance SerDes solutions and Northwest Logic p... » read more

What’s Next?


We just concluded two very successful seminars in Tokyo and Shanghai. Samsung Memory presented their HBM2 solutions, Samsung Foundry talked about their advanced 14nm FinFET solutions, ASE Group reviewed their advanced 2.5D packaging solutions, eSilicon presented our ASIC and 2.5D design/implementation and IP solutions, Rambus detailed their high-performance SerDes solutions and Northwest Logic ... » read more

Advanced ASICs: It Takes An Ecosystem


I remember the days of the IDM (integrated device manufacturer). For me, it was RCA, where I worked for 15 years as the company changed from RCA to GE and then ultimately to Harris Semiconductor. It’s a bit of a cliché, but life was simpler then, from a customer point of view at least. RCA did it all. We designed all the IP, did the physical design, owned fabs, assembly and test facilities a... » read more

Talking The Talk On Training


In my prior post, I discussed the value of good design flow training. A properly executed program can turn average engineers into above average problem solvers with the right tools and techniques. We got to thinking about this opportunity quite seriously at eSilicon. Is there a way to develop a focused, intense training program to create a new “army” of elite designers? In short, we thin... » read more

Training As A Strategic Weapon


In my last post, I discussed the topic of applying machine learning to the design of machine learning chips. I pointed out that one can achieve significant improvements in schedule predictability, PPA compliance and an overall reduction in program risk if machine learning is applied to the right kind of knowledge base. This is very real, and we are seeing the benefits of this approach daily. Bu... » read more

A Learning Machine For Machine Learning


Artificial intelligence and machine learning are hot. Many, many startups, exciting new applications and lots of venture money. The technology promises to change the world. Whether it’s autonomous vehicles, domestic robots or machines that replace doctors and lawyers, the implications are astounding, and somewhat frightening. Let’s put the socio-economic dimension of this discussion aside f... » read more

Historic FinFET/2.5D Firsts


Recently, I had an opportunity to watch the Academy Award nominated movie “Hidden Figures.” If you’re a geek at heart, you need to see this movie. It chronicles the strong contributions of three black women to the NASA space program during the 1960s. The civil rights backstory of the movie is powerful, but there is another aspect of the movie that stayed with me as well: all of the “fir... » read more

Advanced ASICs Are A Team Sport


The recent Super Bowl proved that a team with conviction and focus can do anything. This notion comes in handy when you think about the nearly impossible job of designing and manufacturing an advanced ASIC – in finFET technologies, with an interposer, multiple die, and never-before-proven throughput rates. For these kind of advanced technologies, it does take a village. What works is open, tr... » read more

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