Latency Under Load: HBM2 vs. GDDR6


Steven Woo, Rambus fellow and distinguished inventor, explains why data traffic and bandwidth are critical to choosing the type of DRAM, options for improving traffic flow in different memory types, and how this works with multiple memory types.   Related Video GDDR6 - HBM2 Tradeoffs Why designers choose one memory type over another. Applications for each were clearly delineate... » read more

New Challenges For Data Centers


Rita Horner, senior technical marketing manager in Synopsys’ Solutions Group, looks at the impact of a significant rise in data, why this often leads to big cost increases, and where the bottlenecks are occurring. » read more

Multi-Physics At 5/3nm


Joao Geada, chief technologist at ANSYS, talks about why timing, process, voltage, and temperature no longer can be considered independently of each other at the most advanced nodes, and why it becomes more critical as designs shrink from 7nm to 5nm and eventually to 3nm. In addition, more chips are being customized, and more of those chips are part of broader systems that may involve an AI com... » read more

GDDR6 – HBM2 Tradeoffs


Steven Woo, Rambus fellow and distinguished inventor, talks about why designers choose one memory type over another. Applications for each were clearly delineated in the past, but the lines are starting to blur. Nevertheless, tradeoffs remain around complexity, cost, performance, and power efficiency.   Related Video Latency Under Load: HBM2 vs. GDDR6 Why data traffic and bandw... » read more

2.5D, 3D Power Integrity


Chris Ortiz, principal applications engineer at ANSYS, zeroes in on some common issues that are showing up in 2.5D and 3D packaging, which were not obvious in the initial implementations of these packaging technologies. This includes everything from how to build a power delivery network to minimize the coupling between chips to dealing with variability and power integrity and placement of diffe... » read more

Boosting Analog Reliability


Aveek Sarkar, vice president of Synopsys’ Custom Compiler Group, talks about challenges with complex design rules, rigid design methodologies, and the gap between pre-layout and post-layout simulation at finFET nodes. https://youtu.be/JRYlYJ31LLw » read more

Thermal Guard-Banding


Stephen Crosher, CEO of Moortec, talks with Semiconductor Engineering about the impact of more accurate measurements on power, performance and reliability of designs from 40nm all the way down to 3nm. https://youtu.be/VnX-TiaMVmI » read more

Making Sense Of DRAM


Graham Allan, senior manager for product marketing at Synopsys, examines the different types of DRAM, from GDDR to HBM, which markets they’re used in, and why there is such disparity between them. https://youtu.be/ynvcPfD2cZU     __________________________________ See more tech talk videos here. » read more

Hybrid Memory


Gary Bronner, senior vice president of Rambus Labs, talks about the future of DRAM scaling, why one type of memory won’t solve all needs, and what the pros and cons are of different memories. https://youtu.be/R0hhDx2Fb7Q » read more

Huge Performance Gains Ahead


Rambus Chief Scientist Craig Hampel talks about what will drive the next big performance gains after Moore’s Law, from the data center to the edge. https://youtu.be/ItHCsei7YTc » read more

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