ATE Lab To Fab


Shu Li, business development manager at Advantest, zeroes in on the communication gap between engineers on the design side and the manufacturing/test side, why it exists, and what needs to be done to bridge that gap in order to speed up and improve test quality. https://youtu.be/Nd-5_twbJBw     See other tech talk videos here » read more

Using DSA With EUV


James Lamb, deputy CTO for advanced semiconductor manufacturing and corporate technical fellow at Brewer Science, looks at how directed self-assembly can be used to supplement EUV at advanced nodes. https://youtu.be/PItF4egHOxc     See other tech talk videos here » read more

5G Test And Deployment


Advantest’s Adrian Kwan talks about 5G test, how it will change as the wireless technology evolves toward higher frequency signals, and what happens when many more users and backward compatibility are added to the network. https://youtu.be/x_-3yX7fWak » read more

Variability In Chip Manufacturing


Brewer Science’s Jim Korich talks about how to deal with variability in processes and why consistency in materials is so important at advanced nodes. https://youtu.be/U1KkUmtmqpE » read more

Printed Electronics Materials


Brewer Science’s Dominic Miranda digs into printed electronics, why they’re becoming so important, what materials should be used, and how they can be targeted for specific applications in sensors and edge devices. https://youtu.be/tN2goxrDCqA » read more

Defect Reduction At 7/5nm


Darin Collins, director of metrology at Brewer Science, talks about the cause of defects at advanced nodes and how material purity increasingly plays a role in overall quality and yield. » read more

Tech Talk: 5G Everywhere


Sarah Yost, senior product marketing manager at National Instruments, talks about the promise of 5G, where it works and where it doesn’t work, and why it’s so critical for so many different markets. https://youtu.be/CzxdrrhSvGY » read more

Tech Talk: System In Package


ASE fellow and senior technical advisor William Chen talks about advanced packaging options and why they are now so important. » read more

Tech Talk: 2.5D Issues


Bill Isaacson, director of ASIC marketing at eSilicon, about how viable this packaging approach is, organic vs. inorganic interposers, where the problems are, thermal coupling, interposer cost, and what will change over the next couple years. » read more

Tech Talk: 14nm And Stacked Die


Aashish Malhotra, marketing director for the ASIC Business Unit at GlobalFoundries, talks about 14nm process technology, the IP ecosystem, and why that technology node will be used as a platform for 2.5D and 3D stacked die across a wide range of markets including the Internet of Everything. [youtube vid=ukTRuedB7ZU] » read more

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